公开(公告)号：US20190214749A1

公开(公告)日：2019-07-11

申请号：US15865498

申请日：2018-01-09

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jie CHANG ,  Huibin CHEN ,  Tiburcio MALDO ,  Keunhyuk LEE

IPC: H01R12/58 ,  H01R13/03 ,  H05K3/30 ,  H01L23/495 ,  H01L23/498

Abstract: Implementations of semiconductor packages may include: one or more die electrically coupled to a lead frame. The lead frame may be included within a housing. The semiconductor package may also include a set of signal leads extending from the housing, a set of power leads extending from the housing, and a plurality of press fit pins each fixedly coupled to the set of signal leads and the set of power leads. The set of signal leads and the set of power leads may be configured to couple with a substrate.

公开(公告)号：US20210021065A1

公开(公告)日：2021-01-21

申请号：US17064663

申请日：2020-10-07

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jie CHANG ,  Huibin CHEN ,  Tiburcio MALDO ,  Keunhyuk LEE

IPC: H01R12/58 ,  H01L23/495 ,  H01L23/498 ,  H01R13/03 ,  H05K3/30

Abstract: Implementations of semiconductor packages may include: one or more die electrically coupled to a lead frame. The lead frame may be included within a housing. The semiconductor package may also include a set of signal leads extending from the housing, a set of power leads extending from the housing, and a plurality of press fit pins each fixedly coupled to the set of signal leads and the set of power leads. The set of signal leads and the set of power leads may be configured to couple with a substrate.

公开(公告)号：US20210118774A1

公开(公告)日：2021-04-22

申请号：US16949130

申请日：2020-10-15

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yusheng LIN ,  Jerome TEYSSEYRE ,  Huibin CHEN

IPC: H01L23/492 ,  H01L23/14 ,  H01L23/498 ,  H01L21/48

Abstract: A method includes disposing a plurality of active solder pads and at least one mechanical support solder pad on the substrate. The plurality of active solder pads provide areas for mechanical bonding of the substrate to at least one device contact pad disposed on a semiconductor die. The at least one mechanical support solder pad provides an area for mechanical bonding of the substrate to at least one dummy device contact pad disposed on the semiconductor die. The method further includes mechanically bonding the substrate to the semiconductor die by forming solder joints between the plurality of active solder pads and the at least one device contact pad, and between the at least one mechanical support pad and the at least one dummy device contact pad.

公开(公告)号：US20240222231A1

公开(公告)日：2024-07-04

申请号：US18608662

申请日：2024-03-18

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yusheng LIN ,  Jerome TEYSSEYRE ,  Huibin CHEN

IPC: H01L23/492 ,  H01L21/48 ,  H01L23/00 ,  H01L23/14 ,  H01L23/373 ,  H01L23/498 ,  H01L23/50 ,  H01L23/538 ,  H01L25/18

CPC classification number: H01L23/492 ,  H01L21/4853 ,  H01L21/4875 ,  H01L23/14 ,  H01L23/49811 ,  H01L23/50 ,  H01L24/06 ,  H01L24/14 ,  H01L23/3735 ,  H01L23/5383 ,  H01L25/18

Abstract: A semiconductor die includes an electronic device formed in the semiconductor die. The semiconductor die further includes a plurality of device contact pads disposed on a surface of the semiconductor die. The plurality of device contact pads are electrically connected to the electronic device. The plurality of device contact pads include at least an emitter contact pad and a signal sense contact pad, and a dummy device contact pad disposed on the surface of the semiconductor die. The dummy device contact pad provides an area for a solder joint between the semiconductor die and a substrate in addition to an area provided by the plurality of device contact pads.

公开(公告)号：US20210225797A1

公开(公告)日：2021-07-22

申请号：US17220661

申请日：2021-04-01

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yong LIU ,  Yusheng LIN ,  Huibin CHEN

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/532 ,  H01L23/373 ,  H01L21/56

Abstract: In a general aspect, a method for producing a semiconductor device assembly can include defining a cavity in a conductive spacer, and electrically and thermally coupling a semiconductor die with the conductive spacer, such that the semiconductor die is at least partially embedded in the cavity. The semiconductor die can have a first surface having active circuitry included therein, a second surface opposite the first surface, and a plurality of side surfaces each extending between the first surface of the semiconductor die and the second surface of the semiconductor die. The method can also include electrically coupling a direct bonded metal (DBM) substrate with the first surface of the semiconductor die.

公开(公告)号：US20200144744A1

公开(公告)日：2020-05-07

申请号：US16736277

申请日：2020-01-07

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jie CHANG ,  Huibin CHEN ,  Tiburcio MALDO ,  Keunhyuk LEE

IPC: H01R12/58 ,  H05K3/30 ,  H01R13/03 ,  H01L23/498 ,  H01L23/495

Abstract: Implementations of semiconductor packages may include: one or more die electrically coupled to a lead frame. The lead frame may be included within a housing. The semiconductor package may also include a set of signal leads extending from the housing, a set of power leads extending from the housing, and a plurality of press fit pins each fixedly coupled to the set of signal leads and the set of power leads. The set of signal leads and the set of power leads may be configured to couple with a substrate.