公开(公告)号：US20220293499A1

公开(公告)日：2022-09-15

申请号：US17804423

申请日：2022-05-27

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jinchang ZHOU ,  Asif JAKWANI ,  Chee Hiong CHEW ,  Yusheng LIN ,  Sravan VANAPARTHY ,  Silnore Tejero SABANDO

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/31

Abstract: Implementations of power modules may include: a substrate having a first side and a second side. The power module may include a plurality of leads coupled to a second side of the substrate and a molding compound over a portion of five or more surfaces of the substrate. The power module may also include an opening extending from a first side of the substrate to an outer edge of the molding compound. The opening may be configured to receive a coupling device and the coupling device may be configured to couple with a heat sink or a package support.

公开(公告)号：US20200098671A1

公开(公告)日：2020-03-26

申请号：US16556541

申请日：2019-08-30

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jinchang ZHOU ,  Asif JAKWANI ,  Chee Hiong CHEW ,  Yusheng LIN ,  Sravan VANAPARTHY ,  Silnore Tejero SABANDO

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48

Abstract: Implementations of power modules may include: a substrate having a first side and a second side. The power module may include a plurality of leads coupled to a second side of the substrate and a molding compound over a portion of five or more surfaces of the substrate. The power module may also include an opening extending from a first side of the substrate to an outer edge of the molding compound. The opening may be configured to receive a coupling device and the coupling device may be configured to couple with a heat sink or a package support.

公开(公告)号：US20240169136A1

公开(公告)日：2024-05-23

申请号：US18058382

申请日：2022-11-23

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yun Peng XIAO ,  James Joseph VICTORY ,  Bejoy N. PUSHPAKARAN ,  Ondrej PICHA ,  Wai Lun CHU ,  Sravan VANAPARTHY

IPC: G06F30/367

CPC classification number: G06F30/367

Abstract: Implementations of a method of generating a product system model may include, using a first interface, receiving from a user a selection of a product type; selecting a product SPICE model associated with the product type from a database of product SPICE models; and using a second interface, receiving from the user a selection of a process condition. The method may include, using a third interface, receiving from the user one or more system characteristics and one or more operating characteristics; using a fourth interface, receiving from the user one or more circuit characteristics; using a SPICE model simulation module, generating a SPICE model output with the product SPICE model, and, using a formatting module, formatting the SPICE model output into a product system model file, the product system model file including one of a structured text file, a plain text file, or a delimited text file.

公开(公告)号：US20230027138A1

公开(公告)日：2023-01-26

申请号：US17807749

申请日：2022-06-20

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yushuang YAO ,  Chee Hiong CHEW ,  Vemmond Jeng Hung NG ,  Chuncao NIU ,  Sravan VANAPARTHY

IPC: H05K7/20 ,  H05K7/14

Abstract: A method includes attaching a power electronic substrate to a bottom of a frame. The frame has a box-like rectangular shape with an open top and an open bottom. The method further includes disposing an external conductive terminal on the frame. The external conductive terminal has at least one terminal stub that extends on to the front surface of the power electronic substrate. The method further includes welding the at least one terminal stub to at least one circuit trace disposed on the front surface of the power electronic substrate.