公开(公告)号：US09594113B2

公开(公告)日：2017-03-14

申请号：US14186733

申请日：2014-02-21

Applicant: SENSATA TECHNOLOGIES, INC.

Inventor： Richard A. Davis ,  Christopher Lopez

IPC: G01R31/28 ,  G01R1/067 ,  G01R1/20

CPC classification number: G01R31/2874 ,  G01R1/20 ,  G01R31/2817

Abstract: Methods and apparatus for a package on package (POP) thermal forcing device. A thermal interposer includes a test probe guide and insulator top, a thermal conductor, the test probe guide and insulator top affixed to a top surface of the thermal conductor, a test probe, and a test probe guide and insulator bottom affixed to a bottom surface of the thermal conductor, the test probe guide and insulator bottom configured in a ring-like shape to enable the thermal conductor to pass through and make contact with a bottom of a package on package (PoP) integrated circuit (IC).

Abstract translation: 包装封装（POP）热力装置的方法和装置。 热插入件包括测试探针引导件和绝缘体顶部，热导体，测试探针引导件和绝缘体顶部固定到热导体的顶表面，测试探针和测试探针引导件和绝缘体底部固定到底表面 热导体，测试探针引导件和绝缘体底部构成环形，以使热导体能够通过并与封装（PoP）集成电路（IC）上的封装的底部接触。