公开(公告)号：US20250006748A1

公开(公告)日：2025-01-02

申请号：US18597970

申请日：2024-03-07

Applicant: SENSORTEK TECHNOLOGY CORP.

Inventor： Ping-Jung Chiang ,  Liang-Kuang Wei ,  Yi-Feng Chang

IPC: H01L27/144 ,  H01L25/16 ,  H01L33/00 ,  H01L33/62

Abstract: A light sensor structure and a packaging method thereof are disclosed. The light sensor structure comprises a light emitting element, a light sensing element, an opaque molding substance, an insulation layer and a connection layer. The opaque molding substance encloses the light emitting element and the light sensing element, and the opaque molding substance is provided with a via. The insulation layer is disposed on the bottom surface of the light emitting element, and the insulation layer is provided with a number of connection pads on a side away from the light emitting element and the light sensing element. The connection pads are electrically connected to the contacts on the bottom surface of the light emitting element through the connection layer, and the connection pads are electrically connected to the contacts on the light sensing surface of the light sensing element through the connection layer and the via.