公开(公告)号：US20100296286A1

公开(公告)日：2010-11-25

申请号：US12469711

申请日：2009-05-21

Applicant: SHENG-HSIUNG CHENG

Inventor： SHENG-HSIUNG CHENG

IPC: F21V21/00

CPC classification number: F21V29/004 ,  F21V29/80 ,  F21Y2115/10

Abstract: The LED lamp contains one or more base plates, each having a plurality of through terminal holes connected by a patterned conduction layer. The base plates are separated by support tubes and a number of LEDs have their terminals threaded through the terminal holes and soldered to the conduction layers of the base plates. When the LEDs are turned on, the produced heat is dissipated first by the lengthy terminals of the LEDs between the base plates, and then by the extended conduction layers along the base plates. A large number of LEDs therefore could be packed into an even smaller space and the LED lamp has an even lower production cost.

Abstract translation: LED灯包含一个或多个基板，每个基板具有通过图案化导电层连接的多个通孔端子孔。 基板由支撑管分开，并且多个LED的端子螺纹穿过端子孔并焊接到基板的导电层。 当LED被打开时，产生的热量首先被LED的长度端子消耗在基板之间，然后沿着基板延伸的导电层消散。 因此，大量的LED可以被包装在更小的空间中，并且LED灯具有甚至更低的生产成本。

公开(公告)号：US20120275156A1

公开(公告)日：2012-11-01

申请号：US13548214

申请日：2012-07-13

Applicant: SHENG-HSIUNG CHENG

Inventor： SHENG-HSIUNG CHENG

IPC: F21V29/00

CPC classification number: H05K1/0203 ,  F21K9/00 ,  F21V29/70 ,  F21V29/763 ,  F21V29/80 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K3/3447 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/10363

Abstract: The heat dissipation device for a LED lamp contains an upper piece, at least a lower piece, and a number of heat dissipation elements. The upper piece has a number of first, second, and third plug holes. The second plug holes are aligned with some first plug holes, and they are connected by conductive layers. The other first plug holes are connected by separate conductive layers. The third plug holes are configured on individual conductive layers. A number of LEDs have their leads threaded through the first plug holes, respectively. The heat dissipation elements have their two ends threaded through a second plug hole and a third plug hole, respectively. The leads and the heat dissipation elements are then soldered to their respective conductive layers. A number of tubular sleeves are sandwiched between the upper and lower pieces and the leads of the LEDs are threaded through the tubular sleeves.

Abstract translation: 用于LED灯的散热装置包括上部件，至少一个下部件和多个散热元件。 上部件具有多个第一，第二和第三塞孔。 第二插孔与一些第一插孔对齐，并且它们通过导电层连接。 其他第一个插孔通过单独的导电层连接。 第三个插头孔配置在各个导电层​​上。 许多LED的引线分别穿过第一个插孔。 散热元件的两端分别穿过第二插孔和第三插孔。 然后将引线和散热元件焊接到它们各自的导电层上。 多个管状套管夹在上部和下部之间，并且LED的引线穿过管状套筒。