公开(公告)号：US20240294731A1

公开(公告)日：2024-09-05

申请号：US18575176

申请日：2022-07-27

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Qing WANG ,  Qianfa LIU ,  Dongliang LIU ,  Jinchao DONG ,  Songgang CHAI ,  Yongjing XU ,  Yanhua ZHANG

IPC: C08K3/36 ,  C08J5/24 ,  C08L63/00 ,  C09J163/00

CPC classification number: C08K3/36 ,  C08J5/247 ,  C08L63/00 ,  C09J163/00 ,  C08J2363/00 ,  C08J2371/12 ,  C08J2433/24 ,  C08J2461/06 ,  C08J2467/00 ,  C08K2201/005

Abstract: A resin composition and the use thereof. The resin composition comprises the following components, in percentages by weight: 40-70% of a crosslinkable and curable resin and 30-60% of a filler. The filler is silicon dioxide prepared by means of an organosilicone hydrolysis method; the average particle size D50 of the silicon dioxide is 0.1-3 μm; and the particle size ratio D100:D10 of the silicon dioxide is less than or equal to 2.5. By means of the composition, a prepared adhesive film and resin-coated copper foil have a higher elongation rate, a higher peel strength, low CTE, low Df, better drilling processability and higher electrical strength. A finer line processing capability can be achieved, which can be applied to a printed circuit board material of a multilayer laminate, in particular a printed circuit board material of a multilayer laminate of thin lines.

公开(公告)号：US20240084137A1

公开(公告)日：2024-03-14

申请号：US18266040

申请日：2021-03-19

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Dongliang LIU ,  Qing WANG ,  Junqi TANG ,  Jinchao DONG

IPC: C08L81/06 ,  C08K9/06 ,  C08L79/08

CPC classification number: C08L81/06 ,  C08K9/06 ,  C08L79/08 ,  C08K5/29

Abstract: Resin composition, resin adhesive film, and application thereof. The resin composition comprises the following components in parts by weight: 80-120 parts an epoxy resin, 1-20 parts a carbodiimide compound, 30-130 parts a phenolic resin, 20-250 parts a modified polymer, and 50-500 parts silicon dioxide; where the modified polymer is selected from a polyethersulfone or a polyamide-imide resin. By means of selection and compounding of components, the present resin composition has a uniquely advantageous film forming property, effectively solves the problem of a semi-cured resin adhesive film being prone to cracking or fracture, has outstanding heat resistance, a high glass transition temperature, a high modulus, good strength and toughness, and can to form a high strength stable bond with a metal film, has uniquely advantageous reliability, can amply satisfy printed circuit board and chip packaging performance requirements, and is suitable in a variety of chip packaging processes.