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1.发明申请公开(公告)号：US20180220530A1
公开(公告)日：2018-08-02
申请号：US15744244
申请日：2016-03-02
Applicant: Shengyi Technology Co., Ltd.
Inventor： Guangbing CHEN , Xianping ZENG , Chiji GUAN , Yongjing XU
IPC: H05K1/03 , C08L71/12 , C08L83/04 , C08K5/00 , C08K5/5313
Abstract: The present invention relates to a polyphenyl ether resin composition and a use thereof in a high-frequency circuit substrate. The polyphenyl ether resin composition comprises a vinyl-modified polyphenyl ether resin and an organic silicon resin containing unsaturated double bonds and having a three-dimensional net structure. The high-frequency circuit substrate of the present invention has the advantages of a low dielectric constant, a low dielectric loss, high heat resistance, low water absorption, a high interlayer adhesive force and a high bending strength, and is very suitable as a circuit substrate of high-speed electronic equipment.
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公开(公告)号：US20220210914A1
公开(公告)日：2022-06-30
申请号：US17605820
申请日：2020-01-14
Applicant: Shengyi Technology Co., Ltd.
Inventor： Guangbing CHEN , Xianping ZENG , Yongjing XU , Yongming ZHU
IPC: H05K1/03 , H05K1/09 , B32B5/02 , B32B5/26 , B32B15/14 , B32B15/20 , C08L9/00 , C08L9/06 , C08L51/08
Abstract: A copper clad laminate and a printed-circuit board. The copper clad laminate comprises a dielectric substrate layer and a copper foil layer. The copper foil layer is located on at least one surface of the dielectric substrate layer, wherein the copper foil layer comprises an iron element in a weight content of less than 10 ppm, a nickel element in a weight content of less than 10 ppm, a cobalt element in a weight content of less than 10 ppm, and a molybdenum element in a weight content of 10 ppm. The copper clad laminate has a passive intermodulation PIM of less than −158 dBc (700 MHz/2600 MHz).
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3.发明申请公开(公告)号：US20200157332A1
公开(公告)日：2020-05-21
申请号：US16632584
申请日：2017-10-19
Applicant: Shengyi Technology Co., Ltd.
Inventor： Chiji GUAN , Xianping ZENG , Guangbing CHEN , Haosheng XU
IPC: C08L25/08 , C08J5/24 , C08L83/04 , C09D183/04 , H05K1/02 , C09D125/08 , B32B5/02 , B32B5/26 , H05K1/03 , C08G77/00
Abstract: A thermosetting resin composition and a prepreg and a metal foil-covered laminate made using same, the thermosetting resin composition comprising component (A): a solvent-soluble polyfunctional vinyl aromatic copolymer, the copolymer being a poly-functional vinyl aromatic copolymer having a stoctoal unit derived from monomers comprising divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and component (B): a vinyl-containing organic silicone resin. The prepreg and metal foil-covered laminate made from the thermosetting resin composition have good toughness, and maintain a high glass transition temperature, a low water absorption, dielectric properties and humidity resistance, being suitable for the field of high-frequency and high-speed printed circuit boards and the processing of multilayer printed circuit boards.
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公开(公告)号：US20180037736A1
公开(公告)日：2018-02-08
申请号：US15555212
申请日：2015-09-18
Applicant: Shengyi Technology Co., Ltd.
Inventor： Xianping ZENG , Guangbing CHEN , Chiji GUAN , Wenhua YANG
CPC classification number: C08L71/126 , B32B15/08 , B32B15/085 , B32B15/20 , B32B27/08 , C08F279/02 , C08F290/062 , C08J5/24 , C08J2309/06 , C08J2325/10 , C08J2347/00 , C08J2371/02 , C08J2371/12 , C08J2409/00 , C08J2409/06 , C08J2425/10 , C08J2447/00 , C08J2471/02 , C08L9/06 , C08L25/10 , C08L47/00 , C08L51/08 , C08L71/12 , C08L2201/02 , C08K5/14 , C08K3/36 , C08K5/3415 , C08F220/40
Abstract: The present invention relates to the technical field of copper clad laminates and relates to a resin composition and a pre-preg and a laminate using the composition. The resin composition comprises: (A) a prepolymer of vinyl thermosetting polyphenylene ether and a bifunctional maleimide or a multifunctional maleimide; and, (B) a polyolefin resin. The present invention, by employing the prepolymer of vinyl thermosetting polyphenylene ether and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the vinyl thermosetting polyphenylene ether and the polyolefin resin. An aqueous glue solution so mixed is uniform and consistent, the prepreg has a uniform expression, and a substrate resin area is free of a phase-separation problem. In addition, the maleimide employed is either the bifunctional maleimide or the multifunctional maleimide, relative to a monofunctional maleimide, a substrate so prepared is provided with increased heat resistance, a reduced thermal expansion coefficient, extended thermal stratification time, and increased thermal decomposition temperature.
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公开(公告)号：US20150313012A1
公开(公告)日：2015-10-29
申请号：US14647672
申请日：2013-01-21
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Guangbing CHEN , Xianping ZENG
CPC classification number: H05K1/0366 , B32B15/14 , B32B15/20 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2305/076 , B32B2307/204 , B32B2307/3065 , B32B2457/08 , C08G65/485 , C08G77/20 , C08J5/24 , C08K5/3417 , C08K5/53 , C08K5/5425 , C08K5/549 , C08L71/00 , C08L71/12 , C08L71/126 , C08L83/04 , H05K1/0373 , H05K3/022 , H05K2201/012 , H05K2201/0209
Abstract: Disclosed in the present invention is a resin composition, comprising a modified polyphenylene ether resin and an organic silicon compound containing unsaturated double bonds. Also disclosed is a method for preparing a high-frequency circuit substrate using the resin composition as described above and a high-frequency circuit substrate obtained by the preparation method. The high-frequency circuit substrate of the present invention has a high glass transition temperature, a high thermal decomposition temperature, a high interlayer adhesive force, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit substrate in a high-frequency electronic device.
Abstract translation: 在本发明中公开了一种树脂组合物，其包含改性聚苯醚树脂和含有不饱和双键的有机硅化合物。 还公开了使用上述树脂组合物制备高频电路基板的方法和通过该制备方法获得的高频电路基板。 本发明的高频电路基板具有高玻璃化转变温度，高热分解温度，高层间粘合力，低介电常数和低介电损耗角正切，并且非常适合作为电路基板 高频电子设备。
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Patent Agency Ranking
公开(公告)号：US20160244610A1
公开(公告)日：2016-08-25
申请号：US15027365
申请日：2014-08-11
Applicant: Shengyi Technology Co., Ltd.
Inventor： Guangbing CHEN , Xianping ZENG
IPC: C08L71/12 , C09D171/12 , H05K1/03 , C08J5/24
CPC classification number: C08L71/126 , B32B15/08 , B32B27/04 , C08J5/24 , C08J2371/12 , C08J2483/04 , C08L71/12 , C09D171/12 , H05K1/03 , H05K1/038
Abstract: The present invention discloses a resin composition, comprising an unsaturated thermosetting modified polyphenylether resin and an MQ organosilicon resin containing unsaturated double bonds and having a three-dimensional network structure and hydrolytically condensed from monofunctional siloxane unit (M unit) and tetrafunctional silica unit (Q unit). The present invention further discloses a high-frequency circuit substrate prepared from the aforesaid resin composition and the uses of the aforesaid resin composition in the art. The high frequency circuit substrate of the present invention has a high glass transition temperature, a high thermal decomposition temperature, a high interstratified adhesive force, a low dielectric constant and a low dielectric loss tangent, and are very suitable as the circuit substrates of high frequency electronic equipments.
Abstract translation: 本发明公开了一种树脂组合物，其包含不饱和热固性改性聚苯醚树脂和含有不饱和双键并具有三维网状结构并由单官能硅氧烷单元（M单元）和四官能二氧化硅单元（Q单元）水解缩合的MQ有机硅树脂 ）。 本发明还公开了由上述树脂组合物制备的高频电路基片和本领域中上述树脂组合物的用途。 本发明的高频电路基板具有高玻璃化转变温度，高热分解温度，高分层粘合力，低介电常数和低介电损耗角正切，并且非常适合作为高频电路基板 电子设备。
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7.发明申请公开(公告)号：US20200157261A1
公开(公告)日：2020-05-21
申请号：US16631929
申请日：2017-10-19
Applicant: Shengyi Technology Co., Ltd.
Inventor： Chiji GUAN , Xianping ZENG , Guangbing CHEN , Haosheng XU
IPC: C08F212/36 , C08J5/24 , C08L23/20 , C08L9/00 , C08F236/06 , C08F212/06 , B32B15/082 , B32B15/14
Abstract: Thermosetting resin composition, prepreg, and metal foil clad laminate prepared from same. The thermosetting resin composition comprises (A): a solvent-soluble polyfunctional vinyl aromatic copolymer, the copolymer being a polyfunctional vinyl aromatic copolymer having a structural unit derived from a monomer including a divinyl aromatic compound and an ethyl vinyl aromatic compound, and (B): selected from a polybutadiene resin having a number-average molecular weight of 500 to 10,000; the content of vinyl addition across 1, 2 positions in the molecule of the polybutadiene resin being 50% or more. The prepreg and the copper foil clad laminate prepared from the thermosetting resin composition of the present invention have a good toughness, maintain a high glass-transition temperature and a low water absorption, dielectric property and heat and humidity resistance, and are suitable for use in the field of high-frequency high-speed printed circuit boards and for processing of multilayer printed circuit boards.
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公开(公告)号：US20180037705A1
公开(公告)日：2018-02-08
申请号：US15555826
申请日：2015-09-18
Applicant: Shengyi Technology Co., Ltd.
Inventor： Xianping ZENG , Guangbing CHEN , Chiji GUAN , Wenhua YANG
Abstract: Provided in the present invention are a resin composition and a pre-preg and a laminate using the composition. The resin composition comprises: (A) a prepolymer of a polyolefin resin and a bifunctional maleimide or a multifunctional maleimide; and, (B) vinyl thermosetting polyphenylene ether, where with the weight of the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide being 100 parts by weight, the weight of the vinyl thermosetting polyphenylene ether is 200 to 1000 parts by weight. The present invention, by employing the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the polyolefin resin and vinyl thermosetting polyphenylene ether. An aqueous glue solution so mixed is uniform and consistent, the pre-preg has a uniform expression, and a substrate resin area is free of a phase-separation problem.
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9.发明公开公开(公告)号：US20230257583A1
公开(公告)日：2023-08-17
申请号：US18009156
申请日：2021-03-19
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Guangbing CHEN , Xianping ZENG
CPC classification number: C08L83/04 , C08J5/18 , C08J5/244 , C08K5/0066 , C08L71/12 , C08J2371/12 , C08J2383/07 , C08L2201/02 , C08L2203/20
Abstract: A resin composition, and a resin film, a prepreg, a laminated board, a copper-clad board, and a printed circuit board which comprise same. The resin composition comprises a combination of thermosetting polyphenylene ether resin, vinyl organic silicon resin, and a fully hydrogenated elastomeric polymer; and based on 100 parts by weight of the sum of the addition amounts of the thermosetting polyphenylene ether resin, the vinyl organic silicon resin, and the fully hydrogenated elastomeric polymer, the addition amount of the fully hydrogenated elastomer polymer is 20-50 parts by weight. The copper-clad board prepared from the resin composition has the characteristics of low dielectric constant, low dielectric loss, excellent thermal-oxidative aging resistance, high glass transition temperature, high heat resistance, high peel strength, low water absorption rate, and the like, and can be applied to scenes such as automobile radars in worse use environments.
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10.发明申请公开(公告)号：US20210070980A1
公开(公告)日：2021-03-11
申请号：US16632005
申请日：2017-10-19
Applicant: Shengyi Technology Co., Ltd.
Inventor： Xianping ZENG , Chiji GUAN , Guangbing CHEN , Haosheng XU
Abstract: Thermosetting resin composition, prepreg and metal foil clad laminate made therefrom. The thermosetting resin composition comprises (A): a solvent-soluble multifunctional vinyl aromatic copolymer, wherein same is a multifunctional vinyl aromatic copolymer having structural units from monomers comprising a divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and (B), wherein same is selected from olefin resins having a number-average molecular weight of 500-10,000 and containing 10%-50% by weight of a styrene structure, and the molecules thereof contain a 1,2-addition butadiene structure. The prepreg and copper foil clad laminate made from the thermosetting resin composition of the present invention have a good toughness, and maintain a high glass transition temperature, a low water absorption, excellent dielectric properties and damp heat resistance thereof, and are suitable for use in the field of high frequency and high speed printed circuit boards, and are also suitable for processing multilayer printed circuit boards.
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