公开(公告)号：US20240137690A1

公开(公告)日：2024-04-25

申请号：US18542570

申请日：2023-12-15

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Junjiang FU ,  Yueqiang WANG ,  Chaojie CUI ,  Lei ZHONG ,  Zhi CAI ,  Yingying ZHANG ,  Weihua ZHOU ,  Piyou CHENG

IPC: H04R1/10 ,  H04R1/22 ,  H04R9/02

CPC classification number: H04R1/1075 ,  H04R1/1008 ,  H04R1/105 ,  H04R1/22 ,  H04R9/025 ,  H04R2201/105

Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.

公开(公告)号：US20240137693A1

公开(公告)日：2024-04-25

申请号：US18542531

申请日：2023-12-15

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Junjiang FU ,  Yueqiang WANG ,  Chaojie CUI ,  Lei ZHONG ,  Zhi CAI ,  Yingying ZHANG ,  Weihua ZHOU ,  Piyou CHENG

IPC: H04R1/28 ,  H04R1/10

CPC classification number: H04R1/2811 ,  H04R1/1008 ,  H04R1/105 ,  H04R1/1075 ,  H04R2460/13

Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.

公开(公告)号：US20240137689A1

公开(公告)日：2024-04-25

申请号：US18542561

申请日：2023-12-15

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Junjiang FU ,  Yueqiang WANG ,  Chaojie CUI ,  Lei ZHONG ,  Zhi CAI ,  Yingying ZHANG ,  Weihua ZHOU ,  Piyou CHENG

IPC: H04R1/10 ,  H04R9/02

CPC classification number: H04R1/1075 ,  H04R1/1008 ,  H04R1/105 ,  H04R9/025 ,  H04R2201/105

Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.

公开(公告)号：US20240137684A1

公开(公告)日：2024-04-25

申请号：US18542485

申请日：2023-12-15

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Junjiang FU ,  Yueqiang WANG ,  Chaojie CUI ,  Lei ZHONG ,  Zhi CAI ,  Yingying ZHANG ,  Weihua ZHOU ,  Piyou CHENG

IPC: H04R1/10 ,  H04R5/033

CPC classification number: H04R1/1016 ,  H04R5/0335 ,  H04R2460/13

Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.

公开(公告)号：US20250150760A1

公开(公告)日：2025-05-08

申请号：US19014180

申请日：2025-01-08

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Chaojie CUI ,  Lei ZHANG

IPC: H04R9/02 ,  H04R9/04 ,  H04R9/06

Abstract: Embodiments of the present disclosure provide a loudspeaker including a magnetic circuit assembly and a coil assembly. At least a portion of the coil assembly is provided in a magnetic gap formed by the magnetic circuit assembly, and the coil assembly is electrified to drive a vibrating member to vibrate to produce sound. The coil assembly includes a coil support and a coil. The coil support has an extended end extending toward the magnetic gap, and the extended end has a first step structure. The coil includes an outer coil and an inner coil. The outer coil and the inner coil form a second step structure in a direction close to the coil support. The first step structure and the second step structure are fitted to each other so that the coil is fixedly mounted on the coil support.

公开(公告)号：US20240147134A1

公开(公告)日：2024-05-02

申请号：US18544410

申请日：2023-12-18

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Junjiang FU ,  Yueqiang WANG ,  Chaojie CUI ,  Lei ZHONG ,  Zhi CAI ,  Yingying ZHANG ,  Weihua ZHOU ,  Piyou CHENG

IPC: H04R1/10

CPC classification number: H04R1/105 ,  H04R1/1008 ,  H04R1/1075 ,  H04R2460/13

Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.

公开(公告)号：US20240137692A1

公开(公告)日：2024-04-25

申请号：US18542512

申请日：2023-12-15

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Junjiang FU ,  Yueqiang WANG ,  Chaojie CUI ,  Lei ZHONG ,  Zhi CAI ,  Yingying ZHANG ,  Weihua ZHOU ,  Piyou CHENG

IPC: H04R1/28 ,  H04R1/10 ,  H04R1/34 ,  H04R9/02 ,  H04R9/06

CPC classification number: H04R1/2811 ,  H04R1/1008 ,  H04R1/105 ,  H04R1/1075 ,  H04R1/345 ,  H04R9/025 ,  H04R9/06 ,  H04R2400/11 ,  H04R2460/13

Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.

公开(公告)号：US20240137687A1

公开(公告)日：2024-04-25

申请号：US18544394

申请日：2023-12-18

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Junjiang FU ,  Yueqiang WANG ,  Chaojie CUI ,  Lei ZHONG ,  Zhi CAI ,  Yingying ZHANG ,  Weihua ZHOU ,  Piyou CHENG

IPC: H04R1/10

CPC classification number: H04R1/1058 ,  H04R1/1008 ,  H04R1/105

Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.

公开(公告)号：US20240137683A1

公开(公告)日：2024-04-25

申请号：US18544353

申请日：2023-12-18

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Junjiang FU ,  Yueqiang WANG ,  Chaojie CUI ,  Lei ZHONG ,  Zhi CAI ,  Yingying ZHANG ,  Weihua ZHOU ,  Piyou CHENG

IPC: H04R1/10 ,  H04R9/02

CPC classification number: H04R1/1008 ,  H04R1/105 ,  H04R9/025

Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.

公开(公告)号：US20240137682A1

公开(公告)日：2024-04-25

申请号：US18542801

申请日：2023-12-18

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Junjiang FU ,  Yueqiang WANG ,  Chaojie CUI ,  Lei ZHONG ,  Zhi CAI ,  Yingying ZHANG ,  Weihua ZHOU ,  Piyou CHENG

IPC: H04R1/10 ,  H04R9/02

CPC classification number: H04R1/1008 ,  H04R1/1075 ,  H04R9/025

Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.