公开(公告)号：US20170030569A1

公开(公告)日：2017-02-02

申请号：US15303522

申请日：2014-12-13

Applicant: SHENZHEN TCL NEW TECHNOLOGY CO., LTD

Inventor： Jie Lin ,  Kewen Qiang ,  Xiehe Zhong

IPC: F21V29/70 ,  F21V19/00

CPC classification number: F21V29/70 ,  F21V19/0025 ,  F21V23/00 ,  F21V29/80 ,  F21Y2115/10 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0085 ,  H05K1/0203 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10393 ,  H05K2201/10598 ,  H05K2201/10878

Abstract: The present disclosure provides a LED module. The LED module includes a LED lamp, a heat radiator, and a PCB. The LED lamp includes a LED main body, and a heat conducting block and a pin configured to the main body. The heat conducting block is mounted on the bottom surface of the LED main body towards the PCB. The pin has a free end passing through the PCB, and electrically connecting a bonding pad of the PCB. The heat radiator is caught between the heat conducting block and the PCB, and the heat conducting block resists against the heat radiator. A display device is also provided. The heat introduced by the LED lamp can directly dissipate from the heat conducting block to the heat radiator, thus enhancing the heat dissipation of the LED lamp.

Abstract translation: 本公开提供了一种LED模块。 LED模块包括LED灯，散热器和PCB。 LED灯包括LED主体，以及配置在主体上的导热块和销。 导热块安装在LED主体的底面朝向PCB。 引脚具有通过PCB的自由端，并且电连接PCB的焊盘。 散热器被夹在导热块和PCB之间，导热块抵抗散热器。 还提供了显示装置。 由LED灯引入的热能直接从导热块散发到散热器，从而增强了LED灯的散热。

公开(公告)号：US09829189B2

公开(公告)日：2017-11-28

申请号：US15303522

申请日：2014-12-13

Applicant: SHENZHEN TCL NEW TECHNOLOGY CO., LTD

Inventor： Jie Lin ,  Kewen Qiang ,  Xiehe Zhong

IPC: F21V29/70 ,  F21V23/00 ,  F21V29/80 ,  F21V19/00 ,  F21Y115/10

CPC classification number: F21V29/70 ,  F21V19/0025 ,  F21V23/00 ,  F21V29/80 ,  F21Y2115/10 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0085 ,  H05K1/0203 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10393 ,  H05K2201/10598 ,  H05K2201/10878

Abstract: The present disclosure provides a LED module. The LED module includes a LED lamp, a heat radiator, and a PCB. The LED lamp includes a LED main body, and a heat conducting block and a pin configured to the main body. The heat conducting block is mounted on the bottom surface of the LED main body towards the PCB. The pin has a free end passing through the PCB, and electrically connecting a bonding pad of the PCB. The heat radiator is caught between the heat conducting block and the PCB, and the heat conducting block resists against the heat radiator. A display device is also provided. The heat introduced by the LED lamp can directly dissipate from the heat conducting block to the heat radiator, thus enhancing the heat dissipation of the LED lamp.