公开(公告)号：US20230057667A1

公开(公告)日：2023-02-23

申请号：US17796644

申请日：2020-02-21

Applicant: SHIMADZU CORPORATION

Inventor： Hiroyuki MINATO ,  Nobumitsu FUKUSHIMA ,  Erika BABA

IPC: G01N30/54 ,  G01N30/30

Abstract: A first attachment portion to which a packed column is attachable and a second attachment portion to which a chip column is attachable are housed in a column oven. Designation of a temperature of the column oven is received by a designated temperature receiver. In a case in which the chip column is not attached to the second attachment portion, an upper limit temperature of the column oven is set to a first temperature by a setter. An upper limit temperature of the column oven is set to a second temperature lower than the first temperature in a case in which the chip column is attached to the second attachment portion. A temperature of the column oven is adjusted to a received temperature by a temperature adjuster in a case in which the received temperature is equal to or lower than an upper limit temperature.

公开(公告)号：US20230349868A1

公开(公告)日：2023-11-02

申请号：US17799741

申请日：2020-02-27

Applicant: SHIMADZU CORPORATION

Inventor： Shotaro ANDO ,  Takashi INOUE ,  Tsutomu WATANABE ,  Hiroyuki MINATO ,  Nobumitsu FUKUSHIMA

IPC: G01N30/32 ,  G01N30/16 ,  G01N30/60 ,  B01D15/22

CPC classification number: G01N30/60 ,  B01D15/22 ,  G01N30/16 ,  G01N30/32 ,  G01N2030/027

Abstract: A column accommodation device (1) includes a housing in which a column accommodation space (4) is provided, and a chip column (6) having a plate-shape and having an internal flow path (40) filled with a separation medium (41) is accommodated in the column accommodation space (4). An outer surface of the chip column (6) is provided with openings (42) respectively communicating with both ends of the internal flow path. Inside of the column accommodation space (4) is provided with a guide (18) for guiding the chip column (6) to a predetermined position. The column accommodation device (1) includes a seal device (32) for connecting and releasing pipes (44) to and from the openings (42) of the chip column (6), and a controller (46) configured to perform operation control of the seal device (32), and the controller (46) is configured to fluidly connect the pipes (44) with respect to the openings (42) of the chip column (6) when it is determined that the chip column (6) is arranged at the predetermined position.