公开(公告)号：US20230125043A1

公开(公告)日：2023-04-20

申请号：US17503343

申请日：2021-10-17

Applicant: SHINKAWA LTD.

Inventor： Hiroshi MUNAKATA ,  Yuhei ITO ,  John DITRI ,  Moe Tehrani

IPC: B23K20/10 ,  B23K20/00

Abstract: An ultrasound horn is provided which vibrates a bonding tool, attached at a tip, in a plurality of directions with a simple structure. There is provided an ultrasound horn having: a longitudinal vibration generator; a horn portion; and a torsional vibration generator. The torsional vibration generator includes a body including a polygonal pillar portion, second layered elements in which a plurality of second piezoelectric elements are layered, and which are attached to side surfaces of the polygonal pillar portion, weights, and a pressure application ring which applies a pressure by pressing the second piezoelectric elements against the polygonal pillar portion via the weights.

公开(公告)号：US20220180494A1

公开(公告)日：2022-06-09

申请号：US17605225

申请日：2020-04-07

Applicant: SHINKAWA LTD.

Inventor： Takaya KINJO ,  Shota NAKANO ,  Akira SEKIKAWA ,  Hiroshi MUNAKATA

IPC: G06T7/00 ,  H04N13/156 ,  G06T7/55 ,  G06T7/62 ,  G06T7/70 ,  H04N5/247 ,  H01L23/00

Abstract: Provided is a wire shape measurement device of a semiconductor device comprising a substrate, a semiconductor element, and a wire connecting an electrode of the semiconductor element to an electrode of the substrate. The wire shape measurement device comprises: cameras that capture two-dimensional images of the semiconductor device; and a control unit that examines the shape of the wire based on the two-dimensional images of the semiconductor device acquired by the cameras. The control unit performs pattern matching using information on the position at which the wire is connected to the substrate or the semiconductor element and thickness information of the wire, and by utilizing the pattern matching, the control unit: generates a three-dimensional image of the wire from the two-dimensional images of the semiconductor device acquired by the cameras; and performs shape measurement of the wire based on the generated three-dimensional image of the wire.

公开(公告)号：US20230173541A1

公开(公告)日：2023-06-08

申请号：US17921627

申请日：2021-02-10

Applicant: SHINKAWA LTD.

Inventor： Hiroshi MUNAKATA ,  Takuya ADACHI

IPC: B06B1/06

CPC classification number: B06B1/06

Abstract: An ultrasonic horn includes: a vertical vibration generating portion in which a first ultrasonic vibrator is mounted inside; a horn portion extending forward from the vertical vibration generating portion , amplifying an ultrasonic vibration generated by the vertical vibration generating portion , and to which a capillary is mounted at a front end portion ; and a torsional vibration generating portion extending rearward from the vertical vibration generating portion . The torsional vibration generating portion includes: a rod-shaped body ; vibration members arranged axisymmetrically around a central axis ; second ultrasonic vibrators sandwiched between the rod-shaped body and the vibration members such that a vibration direction is a circumferential direction; and bolts pressurizing the second ultrasonic vibrators.

公开(公告)号：US20240379613A1

公开(公告)日：2024-11-14

申请号：US18692326

申请日：2021-09-16

Applicant: SHINKAWA LTD.

Inventor： Hiroshi MUNAKATA ,  Toshihiko TOYAMA

IPC: H01L23/00

Abstract: The present invention includes a bonding process of bonding a wire to an electrode by a capillary, a wire feeding process of raising the capillary to feed the wire from a tip, a pressing process of moving the capillary to press an inner edge of the capillary against the wire, a scraping process of vibrating the tip of the capillary to form a scrape on a side surface of the wire by the inner edge of the capillary, and a cut-off process of closing a wire clamper and cutting off the wire at a portion of the scrape to form a pin wire extending vertically upward from the electrode.

公开(公告)号：US20220283020A1

公开(公告)日：2022-09-08

申请号：US17626490

申请日：2020-09-03

Applicant: SHINKAWA LTD.

Inventor： Michael KIRKBY ,  Shota NAKANO ,  Hiroshi MUNAKATA

IPC: G01H9/00

Abstract: A vibration detection system (100) detects vibration of an ultrasonic horn (12), of which the front surface is a non-specular surface, and of a capillary (13), wherein the vibration detection system (100) includes a laser light source (20) that irradiates the ultrasonic horn (12) and the capillary (13) with parallel laser light beams (21), a camera (30) having an imaging element (31) that captures an image of the ultrasonic horn (12) and the capillary (13) irradiated with the parallel laser light beams (21), and an image processing device (40) that processes the image captured by the camera (30) and displays a location where vibration occurs.

公开(公告)号：US20220130026A1

公开(公告)日：2022-04-28

申请号：US17428963

申请日：2020-03-12

Applicant: SHINKAWA LTD.

Inventor： Michael KIRKBY ,  Takaya KINJO ,  Hiroshi MUNAKATA

IPC: G06T7/00 ,  H04N7/18 ,  H04R1/02

Abstract: The present invention provides a wire non-attachment inspection system (100) of a semiconductor device (10), wherein: the wire non-attachment inspection system (100) comprises an ultrasonic oscillator (40), an ultrasonic transducer (42), a camera (45), a display (48), and a control unit (50); and the control unit (50) calculates the difference in image between one frame of a captured video and a previous frame before the one frame, and displays, on the display, an image of a wire for which the difference exceeds a prescribed threshold value so as to be displayed differently than the image of another wire.