公开(公告)号：US20240055388A1

公开(公告)日：2024-02-15

申请号：US18037760

申请日：2021-06-22

Applicant: SHINKAWA LTD.

Inventor： Kiyotaka TANAKA

IPC: H01L23/00

CPC classification number: H01L24/78 ,  H01L24/85 ,  H01L2224/85047 ,  H01L2224/85051 ,  H01L2224/78901

Abstract: A bump-forming device (1) includes a bonding tool (15) and a bonding controller (10). The bonding controller is configured to execute a crimping step (S14), a delivery step (S15), a pressing step (S16), and a cutting step (S17), and of the trajectories of the bonding tool (15), at least the trajectory in the delivery step (S15) is determined on the basis of a first parameter relating to a wire (w) and a second parameter relating to the shape of the bonding tool (15).