公开(公告)号：US20220112373A1

公开(公告)日：2022-04-14

申请号：US17421903

申请日：2019-09-18

Applicant: SHOWA DENKO K.K.

Inventor： Chika MINEZAKI

IPC: C08L79/08

Abstract: Provided is a thermosetting resin composition which exhibits low water absorption and excellent reflow resistance properties without compromising heat resistance or moldability. This thermosetting resin composition contains a polyalkenylphenol compound (A), a polymaleimide compound (B), a liquid polybutadiene compound (C) and a radical initiator (D). The liquid polybutadiene compound (C) has structural units represented by formula (1)-1 and, optionally, structural units represented by formula (l)-2 and, optionally, structural units other than the structural units represented by formula (1)-1 and formula (1)-2. If the average number of structural units represented by formula (1)-1 per molecule is denoted by m, the average number of structural units represented by formula (1)-2 per molecule is denoted by n and the average number of structural units other than the structural units represented by formula (1)-1 and formula (1)-2 is denoted by w, the value of m/(m+n+w) is 0.15-1.