Thermosetting resin composition
    1.
    发明授权

    公开(公告)号:US10689493B2

    公开(公告)日:2020-06-23

    申请号:US15531587

    申请日:2015-12-11

    Abstract: A thermosetting resin composition includes a polyalkenyl phenol resin (A) and an aromatic polymaleimide compound (B). Polyalkenyl phenol resin (A) has at least one aromatic ring unit (a1) which may have a 2-alkenyl group bonded thereto and in which a phenolic hydroxyl group is alkyl-etherified, and at least one aromatic ring unit (a2) which has a phenolic hydroxyl group and which may have a 2-alkenyl group bonded thereto. At least one of aromatic ring units (a1, a2) has a 2-alkenyl group. Each aromatic ring unit is bonded by a linking group. When m represents the number of aromatic ring units (a1), and n represents the number of aromatic ring units (a2), n to (m+n) is 10-60%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).

    Process for producing polyvalent glycidyl compound

    公开(公告)号:US10160737B2

    公开(公告)日:2018-12-25

    申请号:US15526161

    申请日:2015-10-28

    Abstract: A polyvalent glycidyl compound is produced from a compound having one or more 2-alkenyl ether groups and two or more 2-alkenyl groups using a hydrogen peroxide aqueous solution as an oxidizing agent to oxidize the 2-alkenyl ether groups and the 2-alkenyl groups. A 2-alkenyl ether compound having two or more (un)substituted 2-alkenyl groups and one or more (un)substituted 2-alkenyl ether groups is oxidized using a hydrogen peroxide aqueous solution as an oxidizing agent in the presence of a tungsten compound and a quaternary ammonium salt as catalysts and of phosphoric acid as a co-catalyst, while controlling the pH of the reaction solution to 1.0-4.0 using an acid other than phosphoric acid. During the oxidation, the step of adding the hydrogen peroxide aqueous solution to the reaction solution and the step of adding the acid other than phosphoric acid thereto are alternately repeated at intervals two or more times.

    Thermosetting resin composition
    3.
    发明授权

    公开(公告)号:US10160856B2

    公开(公告)日:2018-12-25

    申请号:US15533549

    申请日:2015-12-11

    Abstract: Provided is a thermosetting resin composition which exhibits excellent workability, and which is capable of obtaining, as a result of being cured, a highly reliable cured product (molded article) exhibiting excellent heat resistance and mechanical strength. This thermosetting resin composition includes: a polyalkenyl phenol resin (A); an aromatic polymaleimide compound (B); and a polymerization initiator (C). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has a phenolic hydroxyl group having a 2-alkenyl group bonded thereto, and at least one aromatic ring unit (a2) having a phenolic hydroxyl group which does not have a 2-alkenyl group bonded thereto. Each of the aromatic ring units is bonded by a linking group having a main chain which is not formed by an aromatic ring. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of m to (m+n) is 40-90%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B).

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