公开(公告)号：US11335623B2

公开(公告)日：2022-05-17

申请号：US16338697

申请日：2017-09-11

Applicant: SHOWA DENKO K.K.

Inventor： Shinobu Tamura ,  Takayuki Matsuzawa

IPC: B21D53/02 ,  H01L21/48 ,  H01L23/473 ,  H05K7/20 ,  H02M7/48 ,  B23P15/26 ,  F28D21/00

Abstract: [Purpose] To provide is a method capable of producing a heat-dissipating unit easily and at low cost.
[Solution] The method of producing a heat-dissipating unit 12 includes: inserting pins 17 punched out of a second plate member 22 for pins into a plurality of through-holes 16 formed in a first plate member 20 for a substrate. In the first plate member 20, a plurality of substrate forming portions 25 is provided side by side in the longitudinal direction of the first plate member 20. In the second plate member 22, a plurality of pin punch-out portions 26 is provided side by side in the longitudinal direction of the second plate member 22. The method includes: a step A of forming the through-holes 16 in the substrate forming portion 25 of the first plate member 20; a step B of subjecting the pin punch-out portion 26 of the second plate member 22 to a half-punch out process to form half-punched-out pin forming portions 27 protruding from one surface side of the second plate member 22; a step C of forming the pins 17 by punching out the pin forming portions 27 from the second plate member 22 and simultaneously inserting the pins 17 into the through-holes 16 in the first plate member 20; and a step D of forming a substrate by cutting the substrate forming portion 25 with the pins 17 inserted in the through-holes 16 from the first plate member 20.

公开(公告)号：US20130256867A1

公开(公告)日：2013-10-03

申请号：US13900108

申请日：2013-05-22

Applicant: SHOWA DENKO K.K. ,  KABUSHIKI KAISHA TOYOTA JIDOSHOKKI

Inventor： Shogo MORI ,  Shinobu Tamura ,  Shinobu Yamauchi

IPC: H01L23/367

CPC classification number: H01L23/367 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20263 ,  H05K7/2039 ,  H05K7/20518 ,  H01L2924/00

Abstract: A semiconductor device is disclosed that includes an insulation substrate, a metal wiring layer, a semiconductor element, a heat sink, and a stress relaxation member located between the insulation substrate and the heat sink. The heat sink has a plurality of partitioning walls that extend in one direction and are arranged at intervals. The stress relaxation member includes a stress absorbing portion formed by through holes extending through the entire thickness of the stress relaxation member. Each hole is formed such that its dimension along the longitudinal direction of the partitioning walls is greater than its dimension along the arranging direction of the partitioning walls.

Abstract translation: 公开了一种半导体器件，其包括绝缘基板，金属布线层，半导体元件，散热器和位于绝缘基板和散热片之间的应力松弛元件。 散热器具有沿一个方向延伸并且间隔地布置的多个分隔壁。 应力缓和构件包括通过延伸穿过应力松弛构件的整个厚度的通孔形成的应力吸收部分。 每个孔形成为使得其沿着分隔壁的纵向的尺寸大于沿着分隔壁的排列方向的尺寸。

公开(公告)号：USD822625S1

公开(公告)日：2018-07-10

申请号：US29582196

申请日：2016-10-26

Applicant: SHOWA DENKO K.K.

Designer： Shinobu Tamura ,  Takayuki Matsuzawa

公开(公告)号：US11075143B2

公开(公告)日：2021-07-27

申请号：US16309455

申请日：2017-07-11

Applicant: SHOWA DENKO K.K.

Inventor： Shinobu Tamura ,  Takayuki Matsuzawa

IPC: H01L23/473 ,  H05K7/20 ,  F28F3/02

Abstract: A cooling apparatus includes a casing including a top wall, a bottom wall, and a cooling fluid passage. A heat radiator arranged in the cooling fluid passage includes heat radiation units arranged in a vertical direction and at least one intermediate plate each of which is arranged between adjacent heat radiation units of the heat radiation units in the vertical direction. Each of the heat radiation units includes a substrate and pin fins provided on the substrate. The substrate of each of the heat radiation units and the at least one intermediate plate are spaced apart in the vertical direction. The pin fins of the adjacent heat radiation units are in thermal contact with the at least one intermediate plate. The pin fins of the uppermost and lowermost heat radiation units of the heat radiation units are in thermal contact with the top and bottom walls of the casing, respectively.

公开(公告)号：US10770373B2

公开(公告)日：2020-09-08

申请号：US16471566

申请日：2017-11-27

Applicant: SHOWA DENKO K.K.

Inventor： Shinobu Tamura

IPC: H05K7/20 ,  H01L23/473 ,  B23P15/26 ,  F28F3/02 ,  F28F3/06 ,  H01L23/367

Abstract: A radiator for a liquid cooling type cooling device includes a plurality of fin plates and connecting members integrally connecting all the fin plates. The fin plate includes a vertically elongated rectangular flat plate body and narrow portions integrated with both end portions of the plate body. All the fin plates are arranged at intervals in the thickness direction of the plate body. The connecting member is formed into a corrugated shape and includes flat plate portions each integrated with the narrow portion of the plate body and arcuate portions and each connecting the adjacent flat plate portions. The plate body, the narrow portion, and the flat plate portion are equal in thickness. Both side surfaces of the plate body, both side surfaces of the narrow portion, and both side surfaces of the flat plate portion are positioned on the same plane.