公开(公告)号：US20220384300A1

公开(公告)日：2022-12-01

申请号：US17818044

申请日：2022-08-08

Applicant: SHOWA DENKO MATERIALS CO., LTD.

Inventor： Mika KOBUNE ,  Michiaki YAJIMA

IPC: H01L23/367 ,  H01L21/48

Abstract: A method of manufacturing a semiconductor device includes adhering together a heat dissipating body and a plurality of heat generating bodies via a thermally conductive sheet, by applying pressure to the heat dissipating body and the plurality of heat generating bodies in a thickness direction of the thermally conductive sheet with the thermally conductive sheet disposed therebetween, the thermally conductive sheet having a compression modulus of 1.40 MPa or less under a compressive stress of 0.10 MPa at 150° C.

公开(公告)号：US20210183734A1

公开(公告)日：2021-06-17

申请号：US17269524

申请日：2018-08-23

Applicant: SHOWA DENKO MATERIALS CO., LTD.

Inventor： Mika KOBUNE ,  Michiaki YAJIMA

IPC: H01L23/373 ,  H01L23/367 ,  H01L21/48

Abstract: A method of manufacturing a semiconductor device includes adhering together a heat dissipating body and a plurality of heat generating bodies via a thermally conductive sheet, by applying pressure to the heat dissipating body and the plurality of heat generating bodies in a thickness direction of the thermally conductive sheet with the thermally conductive sheet disposed therebetween, the thermally conductive sheet having a compression modulus of 1.40 MPa or less under a compressive stress of 0.10 MPa at 150° C.

公开(公告)号：US20220392825A1

公开(公告)日：2022-12-08

申请号：US17819391

申请日：2022-08-12

Applicant: SHOWA DENKO MATERIALS CO., LTD.

Inventor： Mika KOBUNE ,  Michiaki YAJIMA

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/367

Abstract: A method of manufacturing a semiconductor device includes: adhering together a heat generating body and a heat dissipating body via a thermally conductive sheet by applying a pressure on the heat generating body and the heat dissipating body in a thickness direction of the thermally conductive sheet with the thermally conductive sheet disposed therebetween, the thermally conductive sheet having a compression modulus of 1.40 MPa or less under a compressive stress of 0.10 MPa at 150° C., and a tack strength of 5.0 N·mm or more at 25° C.

公开(公告)号：US20230295398A1

公开(公告)日：2023-09-21

申请号：US18013754

申请日：2020-07-08

Applicant: SHOWA DENKO MATERIALS CO., LTD.

Inventor： Mika KOBUNE ,  Michiaki YAJIMA

IPC: C08K3/04 ,  C08J5/18 ,  H01L23/373 ,  H05K7/20

CPC classification number: C08K3/042 ,  C08J5/18 ,  H01L23/3731 ,  H01L23/3735 ,  H05K7/20481 ,  C08J2323/22 ,  C08K2201/001 ,  C08J2333/10

Abstract: One embodiment of the present invention relates to a thermally conductive sheet containing graphite particles (A) including at least one selected from the group consisting of flake-like particles, ellipsoidal particles, and cylindrical particles, in which the graphite particles (A) are oriented in a thickness direction, and a thickness compression ratio is 24% or more at a temperature of 150° C. and a compressive stress of 0.14 MPa.

公开(公告)号：US20230040001A1

公开(公告)日：2023-02-09

申请号：US17959418

申请日：2022-10-04

Applicant: Showa Denko Materials Co., Ltd.

Inventor： Mika KOBUNE ,  Michiaki YAJIMA

IPC: H01L23/373 ,  H05K7/20 ,  F28F21/02

Abstract: A thermal conduction sheet includes graphite particles (A) of at least one kind selected from the group consisting of flake-shaped particles, ellipsoidal particles, and rod-shaped particles. When the graphite particles (A) are flake-shaped particles, a planar direction of the graphite particles (A) is oriented in a thickness direction of the thermal conduction sheet,when the graphite particles (A) are ellipsoidal particles, a major axis direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, when the graphite particles (A) are rod-like particles, a longitudinal direction of the graphite particles (A) is oriented in the thickness direction of the thermal conduction sheet, the thermal conduction sheet has an elastic modulus of 1.4 MPa or less under a compression stress of 0.1 MPa at 150° C., and the thermal conduction sheet has a tack strength of 5.0 N·mm or higher at 25° C.

公开(公告)号：US20210183733A1

公开(公告)日：2021-06-17

申请号：US17269523

申请日：2018-08-23

Applicant: SHOWA DENKO MATERIALS CO., LTD.

Inventor： Mika KOBUNE ,  Michiaki YAJIMA

IPC: H01L23/373 ,  H01L23/367 ,  H01L21/48

Abstract: A method of manufacturing a semiconductor device includes: adhering together a heat generating body and a heat dissipating body via a thermally conductive sheet by applying a pressure on the heat generating body and the heat dissipating body in a thickness direction of the thermally conductive sheet with the thermally conductive sheet disposed therebetween, the thermally conductive sheet having a compression modulus of 1.40 MPa or less under a compressive stress of 0.10 MPa at 150° C., and a tack strength of 5.0 N·mm or more at 25° C.