公开(公告)号：US20170040248A1

公开(公告)日：2017-02-09

申请号：US14817233

申请日：2015-08-04

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ching-Wen Chiang ,  Kuang-Hsin Chen ,  Sheng-Li Lu ,  Hsien-Wen Chen

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/19 ,  H01L2224/20 ,  H01L2224/92144 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A met of fabricating an electronic package is provided, g: providing a carrier body haying a first surface formed with a plurality of recessed portions, and a second surface opposing the first surface and interconnecting with the recessed portions; forming on the first surface of the carrier body an electronic structure that has a plurality of conductive elements received in the recessed portions correspondingly; and removing a portion of the carrier body, with the conductive elements exposed from the second surface of the carrier body. Therefore, the carrier body is retained, and the fabrication cost is reduced since no temporary material is required. The present invention further provides the electronic package thus fabricated.

Abstract translation: 提供了一种制造电子封装的方法，其特征在于，提供一种载体，该载体体形成有形成有多个凹部的第一表面，以及与该第一表面相对的第二表面，并与该凹部相互连接。 在所述载体主体的第一表面上形成相应地具有容纳在所述凹部中的多个导电元件的电子结构; 以及从载体主体的第二表面露出的导电元件去除载体主体的一部分。 因此，由于不需要临时材料，因此保持了承载体，并且制造成本降低。 本发明还提供如此制造的电子封装。

公开(公告)号：US10199320B2

公开(公告)日：2019-02-05

申请号：US15784782

申请日：2017-10-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Ching-Wen Chiang ,  Kuang-Hsin Chen ,  Sheng-Li Lu ,  Hsien-Wen Chen

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48 ,  H01L23/31 ,  H01L23/538 ,  H01L23/13

Abstract: A method of fabricating an electronic package is provided, including: providing a carrier body having a first surface formed with a plurality of recessed portions, and a second surface opposing the first surface and interconnecting with the recessed portions; forming on the first surface of the carrier body an electronic structure that has a plurality of conductive elements received in the recessed portions correspondingly; and removing portion of the carrier body, with the conductive elements exposed from the second surface of the carrier body. Therefore, the carrier body is retained, and the fabrication cost is reduced since temporary material is required. The present invention further provides the electronic package thus fabricated.

公开(公告)号：US20180040550A1

公开(公告)日：2018-02-08

申请号：US15784782

申请日：2017-10-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Ching-Wen Chiang ,  Kuang-Hsin Chen ,  Sheng-Li Lu ,  Hsien-Wen Chen

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/538 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/19 ,  H01L2224/20 ,  H01L2224/92144 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A method of fabricating an electronic package is provided, including: providing a carrier body having a first surface formed with a plurality of recessed portions, and a second surface opposing the first surface and interconnecting with the recessed portions; forming on the first surface of the carrier body an electronic structure that has a plurality of conductive elements received in the recessed portions correspondingly; and removing portion of the carrier body, with the conductive elements exposed from the second surface of the carrier body. Therefore, the carrier body is retained, and the fabrication cost is reduced since temporary material is required. The present invention further provides the electronic package thus fabricated.

公开(公告)号：US09818683B2

公开(公告)日：2017-11-14

申请号：US14817233

申请日：2015-08-04

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Ching-Wen Chiang ,  Kuang-Hsin Chen ,  Sheng-Li Lu ,  Hsien-Wen Chen

IPC: H01L23/48 ,  H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49838 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/19 ,  H01L2224/20 ,  H01L2224/92144 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A met of fabricating an electronic package is provided, including: providing a carrier body haying a first surface formed with a plurality of recessed portions, and a second surface opposing the first surface and interconnecting with the recessed portions; forming on the first surface of the carrier body an electronic structure that has a plurality of conductive elements received in the recessed portions correspondingly; and removing a portion of the carrier body, with the conductive elements exposed from the second surface of the carrier body. Therefore, the carrier body is retained, and the fabrication cost is reduced since no temporary material is required. The present invention further provides the electronic package thus fabricated.

公开(公告)号：US20170148716A9

公开(公告)日：2017-05-25

申请号：US14817233

申请日：2015-08-04

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Ching-Wen Chiang ,  Kuang-Hsin Chen ,  Sheng-Li Lu ,  Hsien-Wen Chen

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/19 ,  H01L2224/20 ,  H01L2224/92144 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A met of fabricating an electronic package is provided, g: providing a carrier body haying a first surface formed with a plurality of recessed portions, and a second surface opposing the first surface and interconnecting with the recessed portions; forming on the first surface of the carrier body an electronic structure that has a plurality of conductive elements received in the recessed portions correspondingly; and removing a portion of the carrier body, with the conductive elements exposed from the second surface of the carrier body. Therefore, the carrier body is retained, and the fabrication cost is reduced since no temporary material is required. The present invention further provides the electronic package thus fabricated.