公开(公告)号：US20190221542A1

公开(公告)日：2019-07-18

申请号：US16058549

申请日：2018-08-08

Applicant: SK hynix Inc.

Inventor： Kyung Hwan CHO ,  Ga Hyun NO ,  Jin Kyoung PARK ,  Yong Kuk KIM

IPC: H01L25/065

CPC classification number: H01L25/0652 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06586

Abstract: A semiconductor package may include a first chip stack, a second chip stack, and a third chip stack. The third chip stack may include third semiconductor chips, the third chip stack coupled to both of the first and second chip stacks.

公开(公告)号：US20150243596A1

公开(公告)日：2015-08-27

申请号：US14325081

申请日：2014-07-07

Applicant: SK HYNIX INC.

Inventor： Tae Ho LEE ,  Il Hwan CHO ,  In Chul HWANG ,  Ga Hyun NO

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/49827 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A package substrate includes a substrate body and a plurality of patterns disposed on the substrate body. The substrate body has a first region including a chip attachment region and a second region adjacent to the first region. The plurality of patterns are disposed on the substrate body in the second region. Each of the plurality of patterns extends in a first direction to have a stripe shape, and the plurality of patterns are spaced apart from each other in a second direction which is substantially perpendicular to the first direction. Related fabrication methods, electronic systems and memory cards are also provided.

Abstract translation: 封装基板包括基板主体和布置在基板主体上的多个图案。 基板主体具有包括芯片附接区域和与第一区域相邻的第二区域的第一区域。 多个图案设置在第二区域中的基板主体上。 多个图案中的每一个在第一方向上延伸以具有条形形状，并且多个图案在基本上垂直于第一方向的第二方向上彼此间隔开。 还提供了相关的制造方法，电子系统和存储卡。