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公开(公告)号：US12262515B2
公开(公告)日：2025-03-25
申请号：US17831867
申请日：2022-06-03
Applicant: SMA Solar Technology AG
Inventor： Klaus Rigbers , Thomas Wappler , Gerrit Braun , Andreas Knobloch , Matthias Rehbein
Abstract: An inverter with a rated power of at least 3 kVA includes a first assembly which includes a first printed circuit board and a DC/AC converter stage, and a second assembly which includes a second printed circuit board and an EMC filter for the DC/AC converter stage. The first printed circuit board is mounted on a heat sink and lies substantially flat on the heat sink, and the DC/AC converter stage has converter components which comprise power semiconductors, chokes and link circuit capacitors. The chokes and the link circuit capacitors are arranged together on one side of the first printed circuit board, and the heat sink is arranged on the opposite side of the first printed circuit board, and the chokes and/or the power semiconductors are thermally connected to the heat sink via the first printed circuit board and a thermally conductive material arranged between the first printed circuit board and the heat sink. The second printed circuit board is arranged on the side of the first printed circuit board opposite the heat sink, and a metal sheet is arranged between the first assembly and the second assembly, and the second printed circuit board is mounted on the metal sheet.
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公开(公告)号：US20220304184A1
公开(公告)日：2022-09-22
申请号：US17831867
申请日：2022-06-03
Applicant: SMA Solar Technology AG
Inventor： Klaus Rigbers , Thomas Wappler , Gerrit Braun , Andreas Knobloch , Matthias Rehbein
Abstract: An inverter with a rated power of at least 3 kVA includes a first assembly which includes a first printed circuit board and a DC/AC converter stage, and a second assembly which includes a second printed circuit board and an EMC filter for the DC/AC converter stage. The first printed circuit board is mounted on a heat sink and lies substantially flat on the heat sink, and the DC/AC converter stage has converter components which comprise power semiconductors, chokes and link circuit capacitors. The chokes and the link circuit capacitors are arranged together on one side of the first printed circuit board, and the heat sink is arranged on the opposite side of the first printed circuit board, and the chokes and/or the power semiconductors are thermally connected to the heat sink via the first printed circuit board and a thermally conductive material arranged between the first printed circuit board and the heat sink. The second printed circuit board is arranged on the side of the first printed circuit board opposite the heat sink, and a metal sheet is arranged between the first assembly and the second assembly, and the second printed circuit board is mounted on the metal sheet.
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