公开(公告)号：US11066754B2

公开(公告)日：2021-07-20

申请号：US15876300

申请日：2018-01-22

Applicant: SPTS Technologies Limited

Inventor： John Macneil ,  Martin Ayres ,  Trevor Thomas

IPC: C25D17/00 ,  H01L21/67 ,  C25D17/06 ,  H01L21/677 ,  H01L21/687 ,  H01L21/288

Abstract: An apparatus for processing a front face of a semiconductor wafer is provided. The apparatus includes a main chamber, at least one loading port connected to the main chamber for introducing the wafer to the main chamber, at least one stack of wafer processing modules, and a transfer mechanism for transferring the wafer between the loading port and the processing modules. The at least one stack of wafer processing modules includes three or more substantially vertically stacked wafer processing modules, wherein adjacent wafer processing modules in the stack have a vertical separation of less than 50 cm, and each processing module is configured to process the wafer when disposed substantially horizontally therein with the front face of the wafer facing upwards, and at least one wafer processing module is an electrochemical wafer processing module.

公开(公告)号：US10385471B2

公开(公告)日：2019-08-20

申请号：US15887476

申请日：2018-02-02

Applicant: SPTS TECHNOLOGIES LIMITED

Inventor： John Macneil

IPC: C25B9/00 ,  C25D5/08 ,  C25D17/02 ,  C25F7/00 ,  C25D17/00 ,  C25F3/16 ,  C25D21/00 ,  C25D3/38

Abstract: According to the invention a method of removing electrolyte from an electrochemical deposition or polishing chamber comprising the steps of: providing an electrochemical deposition or polishing chamber comprising a support for a substrate, the support having an in-use position; a housing having an interior surface and a fluid outlet pathway for removing electrolyte from the chamber, wherein the fluid outlet pathway includes one or more slots which extend into the housing from at least one slotted opening formed in the interior surface; a seal for sealing the housing to a peripheral portion of a surface of a substrate position on the support in its in-use position; and a tilting mechanism for tilting the chamber in order to assist in removing electrolyte from the housing through the fluid outlet pathway; using an electrolyte to perform an electrochemical deposition or polishing processing on a substrate positioned on the support in its in-use position; and tilting the chamber using the tilting mechanism in order to assist in removing electrolyte from the housing through the fluid outlet pathway.