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公开(公告)号：US10664625B2
公开(公告)日：2020-05-26
申请号：US15542469
申请日：2016-01-06
Applicant: SRI INTERNATIONAL
Inventor： Michael G. Kane
Abstract: A device includes a substrate, an array of metal pads on a first surface of the substrate, a carbon polymer composite covering the array of metal pads, the composite having variations that result in random resistance values between the metal pads usable as a random code. A method of manufacturing a secure device, including forming an array of metal pads on a dielet substrate, the dielet substrate containing at least one memory in which is stored an encryption key, and an RF communication section, covering the array of metal pads with a carbon polymer composite such that variations in the carbon concentration in the polymer forms a unique pattern of resistance, attaching the dielet substrate to a host component, receiving a request from a security server for a unique code determined by the unique pattern of resistance, and using the encryption key, encrypting and providing the unique code to the security server.
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公开(公告)号：US11275109B2
公开(公告)日：2022-03-15
申请号：US16490247
申请日：2018-03-07
Applicant: SRI International
Inventor： Richard Sita , Michael G. Kane
Abstract: Manufacturing integrated circuits is discussed with steps as follows. Creating a wafer with a plurality of dies, where each die contains its own integrated circuit. Fabricating multiple instances of TAP circuitry located in a margin between dies of the wafer. Fabricating on the wafer one row of test pads and power pads per group of dies on the wafer, where the row of test pads and power pads is electrically connected and shared among all of the dies in the group. The test and power pads connect to a chain of TAP circuitry in order to supply operating power as well as testing data to verify the integrity of each die in that group of dies. Singulating the dies to create each instance of the integrated circuit, and during the singulation process, the TAP circuitry located in the margin between the dies is destroyed.
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Patent Agency Ranking
公开(公告)号：US11409919B2
公开(公告)日：2022-08-09
申请号：US16850743
申请日：2020-04-16
Applicant: SRI International
Inventor： Michael G. Kane
Abstract: A device includes a substrate, an array of metal pads on a first surface of the substrate, a carbon polymer composite covering the array of metal pads, the composite having variations that result in random resistance values between the metal pads usable as a random code. A method of manufacturing a secure device, including forming an array of metal pads on a dielet substrate, the dielet substrate containing at least one memory in which is stored an encryption key, and an RF communication section, covering the array of metal pads with a carbon polymer composite such that variations in the carbon concentration in the polymer forms a unique pattern of resistance, attaching the dielet substrate to a host component, receiving a request from a security server for a unique code determined by the unique pattern of resistance, and using the encryption key, encrypting and providing the unique code to the security server.
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公开(公告)号：US20200072899A1
公开(公告)日：2020-03-05
申请号：US16490247
申请日：2018-03-07
Applicant: SRI International
Inventor： Richard Sita , Michael G. Kane
Abstract: Manufacturing integrated circuits is discussed with steps as follows. Creating a wafer with a plurality of dies, where each die contains its own integrated circuit. Fabricating multiple instances of TAP circuitry located in a margin between dies of the wafer. Fabricating on the wafer one row of test pads and power pads per group of dies on the wafer, where the row of test pads and power pads is electrically connected and shared among all of the dies in the group. The test and power pads connect to a chain of TAP circuitry in order to supply operating power as well as testing data to verify the integrity of each die in that group of dies. Singulating the dies to create each instance of the integrated circuit, and during the singulation process, the TAP circuitry located in the margin between the dies is destroyed.
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公开(公告)号：US11580344B2
公开(公告)日：2023-02-14
申请号：US16497098
申请日：2018-03-27
Applicant: SRI International
Inventor： Sterling E. McBride , Michael G. Kane , Alex Krasner , Richard Sita , Winston K. Chan , Mark F. Schutzer
IPC: G06F13/42 , G06K19/07 , G06K19/073 , G06K19/077 , H04L9/08 , H04L9/32 , G06V20/80
Abstract: An integrated circuit having Radio Frequency Identification components and circuitry used for authentication is discussed. The RFID components and circuitry include two or more coils and corresponding electrical circuits that are tuned to use two or more different resonant frequencies including: a first resonant RF used for power generation and a second resonant RF used for data communication. The integrated circuit contains a unique signature that is used for the authentication with two or more aspects including i) a first aspect that is a programmed password in a memory embedded on the integrated circuit, and ii) a second aspect that is a unique, randomly generated code based upon a physical characteristic of the integrated circuit.
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公开(公告)号：US20210158121A1
公开(公告)日：2021-05-27
申请号：US16497098
申请日：2018-03-27
Applicant: SRI International
Inventor： Sterling E. McBride , Michael G. Kane , Alex Krasner , Richard Sita , Winston K. Chan , Mark F. Schutzer
IPC: G06K19/07 , G06K19/073 , G06K19/077 , G06K9/00 , H04L9/32 , H04L9/08
Abstract: An integrated circuit having Radio Frequency Identification components and circuitry used for authentication is discussed. The RFID components and circuitry include two or more coils and corresponding electrical circuits that are tuned to use two or more different resonant frequencies including: a first resonant RF used for power generation and a second resonant RF used for data communication. The integrated circuit contains a unique signature that is used for the authentication with two or more aspects including i) a first aspect that is a programmed password in a memory embedded on the integrated circuit, and ii) a second aspect that is a unique, randomly generated code based upon a physical characteristic of the integrated circuit.
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公开(公告)号：US20200250350A1
公开(公告)日：2020-08-06
申请号：US16850743
申请日：2020-04-16
Applicant: SRI International
Inventor： Michael G. Kane
Abstract: A device includes a substrate, an array of metal pads on a first surface of the substrate, a carbon polymer composite covering the array of metal pads, the composite having variations that result in random resistance values between the metal pads usable as a random code. A method of manufacturing a secure device, including forming an array of metal pads on a dielet substrate, the dielet substrate containing at least one memory in which is stored an encryption key, and an RF communication section, covering the array of metal pads with a carbon polymer composite such that variations in the carbon concentration in the polymer forms a unique pattern of resistance, attaching the dielet substrate to a host component, receiving a request from a security server for a unique code determined by the unique pattern of resistance, and using the encryption key, encrypting and providing the unique code to the security server.
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