公开(公告)号：US3483439A

公开(公告)日：1969-12-09

申请号：US3483439D

申请日：1967-10-18

Applicant: STACKPOLE CARBON CO

Inventor： KOSCO JOHN C

IPC: C22C33/02 ,  H01L21/60 ,  H01L3/00 ,  H01L3/12 ,  H01L5/00

CPC classification number: H01L24/26 ,  C22C33/0285 ,  H01L24/83 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/0133 ,  Y10S75/95 ,  Y10T428/12063 ,  Y10T428/12528 ,  Y10T428/12674 ,  H01L2924/01026 ,  H01L2924/01028

公开(公告)号：US3225169A

公开(公告)日：1965-12-21

申请号：US34700664

申请日：1964-02-24

Applicant: STACKPOLE CARBON CO

Inventor： KOSCO JOHN C

IPC: C22C32/00 ,  H01H1/023 ,  H01H1/0233

CPC classification number: C22C32/0052 ,  H01H1/023 ,  H01H1/0233

公开(公告)号：US3482950A

公开(公告)日：1969-12-09

申请号：US3482950D

申请日：1968-03-28

Applicant: STACKPOLE CARBON CO

Inventor： KOSCO JOHN C

IPC: H01B1/00 ,  H01H1/0233 ,  B22F7/00

CPC classification number: H01B1/00 ,  H01H1/0233 ,  Y10S75/95

公开(公告)号：US3585342A

公开(公告)日：1971-06-15

申请号：US3585342D

申请日：1970-06-03

Applicant: STACKPOLE CARBON CO

Inventor： KOSCO JOHN C

IPC: B23H1/06 ,  B23K35/22 ,  B23K9/16

CPC classification number: B23K35/222 ,  B23H1/06

Abstract: Electrodes for EDM (electric discharge machining) of improved wear performance are provided by consolidated bodies of, by volume, 50 to 90 percent of graphite with the remainder consisting essentially of chromium-iron alloy containing from about one to about 99 volume percent of chromium.

公开(公告)号：US3577275A

公开(公告)日：1971-05-04

申请号：US3577275D

申请日：1969-04-02

Applicant: STACKPOLE CARBON CO

Inventor： KOSCO JOHN C

IPC: H01L21/60 ,  C23C13/08

CPC classification number: H01L24/29 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

Abstract: SEMI-CONDUCTOR CRYSTAL SUPPORTS COMPRISING A BASE OF THE GROUP CONSISTING OF TUNGSTEN AND MOLYBDENUM ARE PREPARED BY OXIDIZING AT LEAST THE SURFACE OF THE BASE TO WHICH A CURRENT LEAD IS TO BE SOLDERED, COATING AT LEAST THAT SURFACE OF THE BASE WITH METAL OF THE GROUP CONSISTING OF SIVER AND COPPER, AND THEN SUBJECTING THE COATED BASE TO HYDROGEN OR OTHER REDUCING ATMOSPHERE AT A TEMPERATURE ABOVE THE MELTING POINT OF THE COATING METAL. PREFERABLY THE DENSITY OF THE BASE IS AT LEAST 93 PERCENT OF THEORETICAL.

公开(公告)号：US3158469A

公开(公告)日：1964-11-24

申请号：US21551462

申请日：1962-08-08

Applicant: STACKPOLE CARBON CO

Inventor： KOSCO JOHN C

IPC: C22C29/06 ,  C22C32/00 ,  H01H1/0233

CPC classification number: C22C32/0052 ,  C22C29/067 ,  H01H1/0233

公开(公告)号：US3068557A

公开(公告)日：1962-12-18

申请号：US13546161

申请日：1961-09-01

Applicant: STACKPOLE CARBON CO

Inventor： KOSCO JOHN C ,  SCHUTZ ALFRED J

IPC: B22F7/02 ,  B22F7/04 ,  C22C32/00 ,  H01L21/00 ,  H01L21/60

CPC classification number: H01L24/26 ,  B22F7/02 ,  B22F7/04 ,  C22C32/00 ,  C22C32/0084 ,  H01L21/00 ,  H01L24/83 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/351 ,  Y10T428/12069 ,  Y10T428/12139 ,  Y10T428/12146 ,  Y10T428/12528 ,  Y10T428/12882 ,  H01L2924/3512 ,  H01L2924/00

Abstract: A semi-conductor diode base consists of an outer layer of silver or copper, an intermediate sintered layer consisting of by weight (a) 40-70 parts silver powder with 60-30 parts graphite powder, or (b) 38-69 parts copper powder with 62-31 parts graphite powder and an overlying layer of silver or copper. In the preferred method the outer layers of silver or copper are also sintered but these layers may also be flame sprayed on to the sintered intermediate layer. Separate layers of the required powders of minus 325 mesh are placed in a die and compacted together at 10-40 tons p.s.i. and then sintered at 1500 DEG F. in a vacuum or neutral atmosphere. The sintered composite may then be coined at 20-40 tons p.s.i. Alternatively the powder layers may be hot pressed.

Abstract translation: 半导体二极管基座由银或铜的外层组成，中间烧结层由（a）40-70份银粉和60-30份石墨粉组成，或（b）38-69份铜 粉末与62-31份石墨粉末和银或铜的上覆层。 在优选的方法中，银或铜的外层也被烧结，但是这些层也可以被火焰喷涂到烧结的中间层上。 将所需的负325目粉末的各层放置在模具中并以10-40吨p.s.i一起压实在一起。 然后在真空或中性气氛中在1500°F下烧结。 然后烧结复合材料可以在20-40吨p.s.i。 或者粉末层可以被热压。