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公开(公告)号：US09245772B2
公开(公告)日：2016-01-26
申请号：US14328348
申请日：2014-07-10
Applicant: STATS ChipPAC, Ltd.
Inventor： JoungIn Yang , ChoongBin Yim , KeonTeak Kang , YoungChul Kim
CPC classification number: H01L21/561 , H01L21/486 , H01L23/147 , H01L23/3114 , H01L23/3128 , H01L23/3135 , H01L23/49827 , H01L24/02 , H01L24/28 , H01L24/29 , H01L24/45 , H01L24/48 , H01L25/03 , H01L2224/0401 , H01L2224/04042 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/16 , H01L2224/16235 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48247 , H01L2224/48464 , H01L2224/48611 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48711 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/83192 , H01L2224/83805 , H01L2224/85205 , H01L2224/85411 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/92247 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15331 , H01L2924/157 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19107 , H01L2924/00014 , H01L2924/0665 , H01L2924/00 , H01L2224/13111 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/83205
Abstract: A semiconductor package comprises a substrate, a first semiconductor die mounted to the substrate, and a first double side mold (DSM) internal stackable module (ISM) bonded directly to the first semiconductor die through a first adhesive. The first DSM ISM includes a first molding compound, and a second semiconductor die disposed in the first molding compound. The semiconductor package further comprises a first electrical connection coupled between the first semiconductor die and the substrate, and a second electrical connection coupled between the first DSM ISM and the substrate.
Abstract translation: 半导体封装包括衬底，安装到衬底的第一半导体管芯和通过第一粘合剂直接结合到第一半导体管芯的第一双面模具（DSM）内部可堆叠模块（ISM）。 第一DSM ISM包括第一模塑料和设置在第一模塑料中的第二半导体模。 半导体封装还包括耦合在第一半导体管芯和衬底之间的第一电连接以及耦合在第一DSM ISM和衬底之间的第二电连接。
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公开(公告)号：US20140319702A1
公开(公告)日：2014-10-30
申请号：US14328348
申请日：2014-07-10
Applicant: STATS ChipPAC, Ltd.
Inventor： JoungIn Yang , ChoongBin Yim , KeonTeak Kang , YoungChul Kim
CPC classification number: H01L21/561 , H01L21/486 , H01L23/147 , H01L23/3114 , H01L23/3128 , H01L23/3135 , H01L23/49827 , H01L24/02 , H01L24/28 , H01L24/29 , H01L24/45 , H01L24/48 , H01L25/03 , H01L2224/0401 , H01L2224/04042 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/16 , H01L2224/16235 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48247 , H01L2224/48464 , H01L2224/48611 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48711 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/83192 , H01L2224/83805 , H01L2224/85205 , H01L2224/85411 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/92247 , H01L2924/00011 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15331 , H01L2924/157 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19107 , H01L2924/00014 , H01L2924/0665 , H01L2924/00 , H01L2224/13111 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/83205
Abstract: A semiconductor package comprises a substrate, a first semiconductor die mounted to the substrate, and a first double side mold (DSM) internal stackable module (ISM) bonded directly to the first semiconductor die through a first adhesive. The first DSM ISM includes a first molding compound, and a second semiconductor die disposed in the first molding compound. The semiconductor package further comprises a first electrical connection coupled between the first semiconductor die and the substrate, and a second electrical connection coupled between the first DSM ISM and the substrate.
Abstract translation: 半导体封装包括衬底，安装到衬底的第一半导体管芯和通过第一粘合剂直接结合到第一半导体管芯的第一双面模具（DSM）内部可堆叠模块（ISM）。 第一DSM ISM包括第一模塑料和设置在第一模塑料中的第二半导体模。 半导体封装还包括耦合在第一半导体管芯和衬底之间的第一电连接以及耦合在第一DSM ISM和衬底之间的第二电连接。
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