公开(公告)号：US20240355773A1

公开(公告)日：2024-10-24

申请号：US18638733

申请日：2024-04-18

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： KyungEun KIM ,  HaengCheol CHOI ,  YoungJin WOO ,  HyunKyum KIM

IPC: H01L23/00 ,  H01L25/065

CPC classification number: H01L24/40 ,  H01L24/08 ,  H01L24/32 ,  H01L24/35 ,  H01L24/37 ,  H01L24/73 ,  H01L25/0657 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/08225 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/35985 ,  H01L2224/37 ,  H01L2224/40225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73255 ,  H01L2224/73257 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2924/151

Abstract: A semiconductor device comprises: a substrate having a set of conductive patterns; a semiconductor die mounted on the substrate, wherein the semiconductor die has on its top surface a set of bonding pads; and a conductive bar assembly for electrically connecting the set of conductive patterns of the substrate with the set of bonding pads of the semiconductor die, wherein the conductive bar assembly comprises: an insulating body; and a set of conductive bars extending within the insulating body, wherein the set of conductive bars have a set of first ends exposed from a first surface of the insulating body to be electrically connected to the set of conductive patterns of the substrate and a set of second ends exposed from a second surface of the insulating body to be electrically connected to the set of bonding pads of the semiconductor die.