公开(公告)号：US11823973B2

公开(公告)日：2023-11-21

申请号：US17451036

申请日：2021-10-15

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： DongSam Park ,  KyungOe Kim ,  WooJin Lee

IPC: H01L23/367 ,  H01L25/00 ,  H01L25/16 ,  H01L25/065 ,  H01L23/552 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L23/552 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L24/16 ,  H01L2224/16225

Abstract: A semiconductor device has a substrate and two semiconductor die disposed over the substrate. A thermal interface material is disposed over the semiconductor die. A conductive epoxy is disposed on a ground pad of the substrate. A lid is disposed over the semiconductor die. The lid includes a sidewall over the ground pad between the semiconductor die. The lid physically contacts the conductive epoxy and thermal interface material.

公开(公告)号：US20230119942A1

公开(公告)日：2023-04-20

申请号：US17451036

申请日：2021-10-15

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： DongSam Park ,  KyungOe Kim ,  WooJin Lee

IPC: H01L23/367 ,  H01L25/00 ,  H01L25/16 ,  H01L23/552 ,  H01L25/065

Abstract: A semiconductor device has a substrate and two semiconductor die disposed over the substrate. A thermal interface material is disposed over the semiconductor die. A conductive epoxy is disposed on a ground pad of the substrate. A lid is disposed over the semiconductor die. The lid includes a sidewall over the ground pad between the semiconductor die. The lid physically contacts the conductive epoxy and thermal interface material.