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公开(公告)号：US20220287185A1
公开(公告)日：2022-09-08
申请号：US17753169
申请日：2020-07-31
Applicant: STEMCO CO., LTD.
Inventor： Jin Han LEE , Sung Jin LEE , Jin Ho KIM
Abstract: A circuit board includes: a base substrate in which a protective layer formation region is defined; a wiring pattern which is formed on the base substrate and which has at least a portion formed in the protective layer formation region; a protective layer fixed onto the protective layer formation region and formed of a protective material; and a bleed prevention pattern formed on the base substrate so as to prevent the protective material from flowing beyond the protective layer formation region when the protective layer is formed.
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