公开(公告)号：US20210391226A1

公开(公告)日：2021-12-16

申请号：US17346766

申请日：2021-06-14

Applicant: STMICROELECTRONICS, INC.

Inventor： Rennier RODRIGUEZ ,  John Alexander SORIANO ,  Aaron CADAG

IPC: H01L23/043 ,  H01L21/48 ,  H01L21/52 ,  H01L23/495

Abstract: One or more embodiments are directed to semiconductor device packages having a cap with integrated metal interconnects or conductive leads. One embodiment is directed to a semiconductor device package that includes a cap having a cover extending along a first direction and sidewalls extending from the cover along a second direction that is transverse to the first direction. A plurality of electrical leads are disposed on inner surfaces of the sidewalls and extend over lower surfaces of the sidewalls. A semiconductor die is attached to an inner surface of the cover of the cap, and the semiconductor die is electrically coupled to the plurality of electrical leads.