公开(公告)号：US20240063162A1

公开(公告)日：2024-02-22

申请号：US18497691

申请日：2023-10-30

Applicant: STMICROELECTRONICS (TOURS) SAS

Inventor： Olivier ORY ,  Christophe LEBRERE

IPC: H01L23/00 ,  H01L25/10

CPC classification number: H01L24/16 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/11916 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2224/8185

Abstract: The present disclosure relates to a die comprising metal pillars extending from a surface of the die, the height of each pillar being substantially equal to or greater than 20 μm, the pillars being intended to raise the die when fastening the die by means of a bonding material on a surface of a support. The metal pillars being inserted into the bonding material at which point the bonding material is annealed to be cured and hardened solidifying the bonding material to couple the die to the surface of the support.

公开(公告)号：US20220068866A1

公开(公告)日：2022-03-03

申请号：US17458070

申请日：2021-08-26

Applicant: STMICROELECTRONICS (TOURS) SAS

Inventor： Olivier ORY ,  Christophe LEBRERE

IPC: H01L23/00 ,  H01L25/10

Abstract: The present disclosure relates to a die comprising metal pillars extending from a surface of the die, the height of each pillar being substantially equal to or greater than 20 μm, the pillars being intended to raise the die when fastening the die by means of a bonding material on a surface of a support. The metal pillars being inserted into the bonding material at which point the bonding material is annealed to be cured and hardened solidifying the bonding material to couple the die to the surface of the support.