公开(公告)号：US20250112107A1

公开(公告)日：2025-04-03

申请号：US18890514

申请日：2024-09-19

Applicant: STMicroelectronics International N.V.

Inventor： Roseanne DUCA

IPC: H01L23/367 ,  H01L21/48

Abstract: At least one package includes a die including a first surface, a second surface opposite to the first surface, and one or more sidewalls transverse to the first surface and the second surface. The one or more sidewalls extend from the first surface to the second surface. A plurality of separate and distinct heat sinks is on the first surface of the die. Each respective separate and distinct heat sink of the plurality of separate and distinct heat sinks is separate and distinct from adjacent separate and distinct heat sinks of the plurality of separate and distinct heat sinks. A plurality of channels separates each respective heat sink of the plurality of heat sinks from adjacent heat sinks of the plurality of heat sinks. In some packages, an elastic thermally conductive material is present within and fills the plurality of channels.

公开(公告)号：US20240228264A9

公开(公告)日：2024-07-11

申请号：US17973084

申请日：2022-10-25

Applicant: STMicroelectronics International N.V.

Inventor： Roseanne DUCA

IPC: B81B3/00 ,  B81C1/00 ,  H01L21/48 ,  H01L23/00 ,  H01L23/492 ,  H01L25/00 ,  H01L25/065

CPC classification number: B81B3/0072 ,  B81C1/00666 ,  H01L21/4875 ,  H01L23/4924 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/012 ,  B81B2207/015 ,  B81B2207/07 ,  B81B2207/096 ,  B81C2203/038 ,  B81C2203/0771 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06548 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/167

Abstract: A sensor package includes a packaging formed by a package bottom, first and second sidewalls extending upwardly from first and second opposite sides of the package bottom, and third and fourth sidewalls extending upwardly from third and fourth opposite sides of the package bottom, the sidewalls and package bottom defining a cavity. An integrated circuit is attached to the package bottom. A plate extends between two of the sidewalls within the cavity and is spaced apart from the package bottom. Sensors are attached to a top surface of the plate on opposite sides of an opening. Wire bondings electrically connect pads on a top face of the sensor to corresponding pads on a top face of the integrated circuit, for example by passing through the opening in the plate or passing past a side end of the plate. A lid extends across and between the sidewalls to close the cavity.