公开(公告)号：US11387270B2

公开(公告)日：2022-07-12

申请号：US16535123

申请日：2019-08-08

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Do Jae Yoo ,  Byoung Heon Kim ,  Yong Gil Namgung ,  Jong Cheol Hong ,  Si Joong Yang

IPC: H01L27/146 ,  H01L23/00

Abstract: An image sensor package includes a substrate, an image sensor mounted on the substrate, a bonding wire connecting the image sensor to the substrate, a reflector disposed on the image sensor, a sealing member sealing the bonding wire and a portion of the image sensor, and covering at least a portion of the reflector, the sealing member including a hole exposing an effective imaging plane of the image sensor, and a filter attached to the sealing member.