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公开(公告)号：US20210249791A1
公开(公告)日：2021-08-12
申请号：US17245380
申请日：2021-04-30
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Nam Ki KIM , Jae Min KEUM , Won Cheol LEE , Dae Ki LIM , Eun Young JUNG , Jeong Ki RYOO
Abstract: An antenna apparatus may include: a feed line; a ground plane disposed around a portion of the feed line; a feed via electrically connected to the feed line; a first end-fire antenna pattern disposed in front of the ground plane to be spaced apart from the ground plane, and electrically connected to the feed via; a second end-fire antenna pattern electrically connected to the feed line and disposed farther forward than the first end-fire antenna pattern; and a third end-fire antenna pattern electrically connected to the feed via, and disposed in front of the first end-fire antenna pattern in such a manner that a portion of the third end-fire antenna pattern overlaps the second end-fire antenna pattern.
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公开(公告)号：US20210242591A1
公开(公告)日：2021-08-05
申请号：US17022542
申请日：2020-09-16
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Nam Ki KIM , Jeong Ki RYOO , Won Cheol LEE , Jae Min KEUM , Dong Ok KO , Shin Haeng HEO
Abstract: An antenna apparatus includes a dielectric layer; a patch antenna pattern disposed on an upper surface of the dielectric layer and including an upper surface having a polygonal shape, a plurality of feed vias respectively disposed to penetrate the dielectric layer by at least a portion of a thickness of the dielectric layer, respectively disposed to be biased toward a first side and a second side, different from each other, from a center of the polygonal shape of the patch antenna pattern, and respectively disposed to be spaced apart from the patch antenna pattern, and a plurality of feed patterns respectively electrically connected to an upper end of a corresponding feed via, among the plurality of feed vias, respectively disposed to be spaced apart from the patch antenna pattern, and configured to provide a feed path to the patch antenna pattern, wherein the polygonal shape of the patch antenna pattern has a structure in which the first side and a third side between the first and second sides form an obtuse angle, and the third side and the second side form an obtuse angle.
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公开(公告)号：US20230208035A1
公开(公告)日：2023-06-29
申请号：US17981668
申请日：2022-11-07
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Hwan JI , Jungil KIM , Hyunjun CHOI , Chin Mo KIM , Won Cheol LEE
IPC: H01Q9/04
CPC classification number: H01Q9/0414 , H01Q9/045 , H01Q21/08
Abstract: An antenna apparatus includes a dielectric layer; and a via that extends through the dielectric layer, the via includes a conductive first portion and a non-conductive second portion surrounded by the conductive first portion. An antenna of the antenna apparatus is fed through the via.
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公开(公告)号：US20220344821A1
公开(公告)日：2022-10-27
申请号：US17858332
申请日：2022-07-06
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Ju Hyoung PARK , Won Cheol LEE , Sung Yong AN , Kyu Bum HAN
Abstract: A chip antenna module includes: a solder layer disposed on a lower surface of the first dielectric layer; a first patch antenna pattern disposed on upper surface of the first dielectric layer and having a through-hole; a second patch antenna pattern spaced apart from an upper surface of the first patch antenna pattern and having an area less than an area of the first patch antenna pattern; a first feed via extending through the first dielectric layer and electrically connected to the first patch antenna pattern; a second feed via extending through the first dielectric layer and the through-hole, and electrically connected to the second patch antenna pattern; and shielding vias extending through the first dielectric layer, electrically connected to the first patch antenna pattern, and at least partially surrounding the second feed via.
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公开(公告)号：US20220224018A1
公开(公告)日：2022-07-14
申请号：US17711592
申请日：2022-04-01
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Myeong Woo HAN , Ju Hyoung PARK , Dae Ki LIM , Jeong Ki RYOO , Won Cheol LEE , Nam Ki KIM
Abstract: An antenna module includes: an IC package including an IC; first and second antenna portions including respective patch antenna patterns, respective feed vias connected to the respective patch antenna patterns, and respective dielectric layers surrounding the respective feed vias; and a connection member having an upper surface on which the first and second antenna portions are disposed and a lower surface on which the IC package is disposed, the connection member forming an electrical connection path between the IC and the feed via of the first antenna portion and an electrical connection path of the second antenna portion. The connection member includes a first region disposed between the IC package and the first antenna portion, a second region on which the second antenna portion is disposed, and a third region electrically connecting the first and second regions and being more flexible than the dielectric layer of the first antenna portion.
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Patent Agency Ranking
公开(公告)号：US20210376450A1
公开(公告)日：2021-12-02
申请号：US17404411
申请日：2021-08-17
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jeong Ki RYOO , Ju Hyoung PARK , Nam Ki KIM , Dae Ki LIM , Won Cheol LEE , Hong In KIM
Abstract: A chip antenna module array includes a connection member and chip antenna modules mounted on the connection member. Each chip antenna module includes: a first patch antenna dielectric layer; a feed via extending through the first patch antenna dielectric layer; and a patch antenna pattern disposed on an upper surface of the first patch antenna dielectric layer and configured to be fed from the feed via. At least one chip antenna module includes: a ground pattern disposed on a lower surface of the first patch antenna dielectric layer; a chip-antenna feed line including a second part disposed on a lower surface of the ground pattern, and electrically connecting a connection member feed line to the feed via; a first feed line dielectric layer disposed on a lower surface of the second part; and a solder layer disposed on a lower surface of the first feed line dielectric layer.
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公开(公告)号：US20210044028A1
公开(公告)日：2021-02-11
申请号：US16738375
申请日：2020-01-09
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Won Cheol LEE , Jeong Ki RYOO , Nam Ki KIM , Myeong Woo HAN , Sang Hyun KIM
Abstract: An antenna apparatus includes a ground plane, a plurality of first patch antenna patterns arranged on a level higher than the ground plane and each configured to transmit and/or receive a first radio frequency signal of a first frequency, a plurality of second patch antenna patterns arranged on a level higher than the ground plane and each having a size smaller than a size of each of the first patch antenna patterns, wherein the plurality of second patch antenna patterns include at least one feed patch antenna pattern configured to transmit and/or receive a second radio frequency signal of a second frequency different from the first frequency, and at least one dummy patch antenna pattern which is not fed any of the first and second radio frequency signals.
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公开(公告)号：US20200328518A1
公开(公告)日：2020-10-15
申请号：US16661241
申请日：2019-10-23
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Ju Hyoung PARK , Won Cheol LEE , Sung Yong AN , Kyu Bum HAN
Abstract: A chip antenna module includes: a solder layer disposed on a lower surface of the first dielectric layer; a first patch antenna pattern disposed on upper surface of the first dielectric layer and having a through-hole; a second patch antenna pattern spaced apart from an upper surface of the first patch antenna pattern and having an area less than an area of the first patch antenna pattern; a first feed via extending through the first dielectric layer and electrically connected to the first patch antenna pattern; a second feed via extending through the first dielectric layer and the through-hole, and electrically connected to the second patch antenna pattern; and shielding vias extending through the first dielectric layer, electrically connected to the first patch antenna pattern, and at least partially surrounding the second feed via.
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公开(公告)号：US20230216202A1
公开(公告)日：2023-07-06
申请号：US17980203
申请日：2022-11-03
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Juhyoung PARK , Daeki LIM , Won Cheol LEE , Jeongki RYOO , Sungyong AN , Chin Mo KIM
CPC classification number: H01Q9/0414 , H01Q9/045 , H01Q5/307 , H01Q21/08
Abstract: An antenna device according to embodiment includes: a first dielectric layer; a second dielectric layer disposed on the first dielectric layer; a third dielectric layer disposed on the second dielectric layer; a first antenna including a first feed via passing through the first dielectric layer and a first antenna patch disposed in a first surface of the first dielectric layer; and a second antenna including a second feed via passing through the first dielectric layer and a second antenna patch disposed in the first surface of the first dielectric layer, wherein a dielectric constant of the second dielectric layer is lower than a dielectric constant of the first dielectric layer and a dielectric constant of the third dielectric layer, and the second dielectric layer has a cavity overlapping the second antenna patch.
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公开(公告)号：US20210408687A1
公开(公告)日：2021-12-30
申请号：US17473214
申请日：2021-09-13
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Won Cheol LEE , Nam Ki KIM , Jae Min KEUM , Jeong Ki RYOO
Abstract: An antenna apparatus includes a first patch antenna pattern comprising a through-hole, a second patch antenna pattern disposed above the first patch antenna pattern and spaced apart from the first patch antenna pattern, a first feed via electrically connected to the first patch antenna pattern, a second feed via penetrating through the through-hole of the first patch antenna pattern, and a feed pattern disposed between the first patch antenna pattern and the second patch antenna pattern, and having one end connected to the second feed via, and another end connected to the second patch antenna pattern at a point closer to an edge of the second patch antenna pattern than the second feed.
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