公开(公告)号：US20250167460A1

公开(公告)日：2025-05-22

申请号：US19032951

申请日：2025-01-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myeongsu OH ,  Jungchul AN ,  Sangkyu KIM ,  Jin KIM ,  Chanbeom JEONG ,  Duho CHU ,  Hyunju HONG

IPC: H01Q21/28 ,  H01Q1/24 ,  H01Q5/25

Abstract: An electronic device is provided. The electronic device includes a housing at least partially made of a conductive material, a printed circuit board, a first antenna configured to operate using a first conductive portion of the housing, a second antenna configured to operate using a second conductive portion of the housing, a third antenna configured to operate using a third conductive portion of the housing, a fourth antenna disposed on the printed circuit board, a first communication module connected to the first antenna, the second antenna, and the third antenna, and a second communication module connected to the fourth antenna, wherein the printed circuit board includes a first portion formed to surround a space where at least one electronic component is disposed, a second portion facing the first portion, and a third portion arranged between the first section and the second section, wherein the first communication module is disposed on the first portion or the third portion of the printed circuit board, and the wherein fourth antenna is disposed on the second portion of the printed circuit board.

公开(公告)号：US20190261515A1

公开(公告)日：2019-08-22

申请号：US16281702

申请日：2019-02-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wangik SON ,  Minho KIM ,  Sunghyun KIM ,  Eungwon KIM ,  Chanbeom JEONG

IPC: H05K1/14 ,  H05K1/02 ,  H01R12/51 ,  H01R4/04

Abstract: An electronic device is provided. The electronic device includes a conductive support member, a first circuit board connected to the conductive support member by a first capacitor, a second circuit board connected to the conductive support member by a second capacitor, a first conductive connection member electrically connecting the first circuit board and the second circuit board, and a first ground structure, at least a portion of the first ground structure being interposed between the first conductive connection member and the conductive support member. The ground structure includes a non-conductive layer physically contacting the conductive support member, and a conductive layer electrically connected to the first conductive connection member to form a capacitive coupling with the conductive support member.