公开(公告)号：US20190229771A1

公开(公告)日：2019-07-25

申请号：US16315940

申请日：2017-03-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ju-Hyang LEE ,  Keumsu SONG ,  Dongzo KIM ,  Yusu KIM ,  Seho PARK ,  Jung-Oh SUNG ,  Mincheol HA ,  Changjong SON ,  Seung-Nyun KIM ,  Yong Sang YUN

IPC: H04B5/00 ,  H02J50/12 ,  H02H9/04 ,  H02J50/70

Abstract: According to one embodiment of the present invention, an electronic apparatus can comprises: at least one antenna; a first circuit for wirelessly receiving or transmitting power by using at least one part of the at least one antenna; a second circuit for performing at least one communication by using at least one part of the at least one antenna; a first electrical path for connecting the at least one antenna to the first circuit; a second electrical path for connecting the at least one antenna to the second circuit; a third electrical path for connecting a point on the first electrical path to a point on the second electrical path; and at least one passive element or active element connected to at least one of the first electrical path, the second electrical path, and the third electrical path.

公开(公告)号：US20250159844A1

公开(公告)日：2025-05-15

申请号：US18946026

申请日：2024-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Boram KIM ,  Ohhyuck KWON ,  Youngjin KIM ,  Min PARK ,  Jungoh SUNG ,  Changjong SON ,  Yoonhee CHANG ,  Jinhwan JUNG ,  Jieun HWANG ,  Jihyeon SON ,  Jeonggen YOON

IPC: H05K7/20 ,  H05K9/00

Abstract: The disclosure relates to an electronic device. An electronic device according to an embodiment of the disclosure may comprise: a printed circuit board, a first electronic component mounted on the printed circuit board, a second electronic component mounted in a first area of a surface of the first electronic component, and a thermoresponsive heat dissipation member comprising a heat dissipation material and contacting a second area of the surface of the first electronic component and a top surface of the second electronic component. The heat dissipation member is configured to be in a solid phase and is configured to be softened based on a temperature of the heat dissipation member.