公开(公告)号：US20240411235A1

公开(公告)日：2024-12-12

申请号：US18419219

申请日：2024-01-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dae Geun YOON ,  Sung Hyup Kim ,  In Jae Lee

IPC: G03F7/00 ,  H01L21/67 ,  H01L21/68 ,  H01L21/683

Abstract: A semiconductor manufacturing apparatus includes a wafer stage, a wafer table including main body supported by the wafer stage and a protrusion protruding from a sidewall of the main body in a first direction, a position module on an upper surface of the wafer table and configured to move in the first direction and a second direction intersecting the first direction, an electrostatic chuck on an upper surface of the position module, a first cable connected to the position module, the first cable extending in the first direction and configured to move the position module in the first direction, a second cable between a bottom surface of the protrusion and a lower wall of the wafer stage, the second cable extending in the second direction and configured to move the position module in the second direction, and a cable connecting member connecting the first cable and the second cable.