公开(公告)号：US20230193080A1

公开(公告)日：2023-06-22

申请号：US18060120

申请日：2022-11-30

Applicant: Samsung Electronics Co., Ltd

Inventor： YEA RIN BYUN ,  IN KWON KIM ,  SANG KYUN KIM ,  HYO SAN LEE ,  BYUNG KEUN HWANG

IPC: C09G1/02 ,  B24B37/04 ,  H01L21/321

CPC classification number: C09G1/02 ,  B24B37/044 ,  H01L21/3212

Abstract: Slurry compositions for chemical mechanical polishing, chemical mechanical polishing apparatuses using the same, and methods for fabricating a semiconductor device using the same are provided. The slurry composition for chemical mechanical polishing may include polishing particles in an amount of 0.1% to 10% by weight of the slurry composition, an oxidant in an amount of 0.1% to 5% by weight of the slurry composition, a thermo-sensitive agent in an amount of 0.01% to 30% by weight of the slurry composition. The thermo-sensitive agent may include metal nanoparticles or metal oxide nanoparticles, and water, wherein the slurry composition has a pH of 1 to 8.

公开(公告)号：US20230167566A1

公开(公告)日：2023-06-01

申请号：US17874442

申请日：2022-07-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： IN KWON KIM ,  Kyu Hyoung Lee ,  Sang Kyun Kim ,  Chul Oh Park ,  Min Young Kim ,  Hyo San Lee

IPC: C25C7/00 ,  C25C5/00 ,  C25C7/04 ,  C25C7/08

CPC classification number: C25C7/002 ,  C25C5/00 ,  C25C7/04 ,  C25C7/08

Abstract: Cerium oxide nanoparticles and methods of fabricating the same are provided. The cerium oxide nanoparticles may be fabricated by a method that may include injecting metal ions into cerium oxide particles and then removing (e.g., desorbing) at least some of the injected metal ions from the cerium oxide particles.