公开(公告)号：US12022614B2

公开(公告)日：2024-06-25

申请号：US17487673

申请日：2021-09-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bongkyu Min ,  Taewoo Kim ,  Jinyong Park ,  Hyelim Yun ,  Hyeongju Lee ,  Sanghoon Park ,  Jiseon Han

IPC: H05K1/00 ,  H01L23/528 ,  H04M1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/141 ,  H01L23/528 ,  H04M1/0277 ,  H05K1/111 ,  H05K1/115 ,  H05K1/144 ,  H05K2201/10378

Abstract: The disclosure relates to an electronic device including an interposer. The interposer includes a substrate and a plurality of connecting structures disposed on the substrate and electrically connecting a first circuit board and a second circuit board disposed in the electronic device. The plurality of connecting structures includes a plurality of via holes formed in the substrate, a plurality of conductive members disposed in the plurality of via holes, an insulating member disposed between the plurality of conductive members, and a plurality of pads disposed on the outer periphery of the plurality of conductive members. The plurality of conductive members may be separately disposed on the substrate to electrically connect with the first and second circuit boards.