公开(公告)号：US11189071B2

公开(公告)日：2021-11-30

申请号：US16778118

申请日：2020-01-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongpil Park ,  Yunhyeong Kim ,  Jaeeun Yang ,  Kihwan Choi ,  Chanmin Park ,  Jungeun Lee

IPC: G06T13/40 ,  G06T1/60 ,  G06F3/01 ,  G06F3/041

Abstract: An electronic device includes a display, at least one sensor, a processor operatively connected to the display and the at least one sensor, and a memory operatively connected to the processor. The memory stores instructions that, when executed, cause the processor to control the electronic device to obtain a first input associated with generation of a first avatar animation, to obtain first data for a first object based on the obtained first input, to obtain second data for a second object based on the obtained first input and a specified scheme, to generate the first avatar animation based on the first data and the second data, and to display the first avatar animation.

公开(公告)号：US10904452B2

公开(公告)日：2021-01-26

申请号：US16229675

申请日：2018-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byungpo Choi ,  Insu Yu ,  Jongpil Park ,  Jinho Lim ,  Jiyoon Park

IPC: H04N5/235

Abstract: An electronic device is provided. The electronic device includes a memory, a camera module, and a processor electrically connected to the memory and the camera module. The processor is configured to determine a first exposure value based on a brightness of an external object, sequentially capture a plurality of images using a first exposure value, a second exposure value having an exposure value less than the first exposure value, the first exposure value, and a third exposure value having an exposure value greater than the first exposure value, when a specified condition is satisfied, select a set of continuous images from the plurality of images, and generate a composite image using the set of continuous images.

公开(公告)号：US09207272B2

公开(公告)日：2015-12-08

申请号：US14026168

申请日：2013-09-13

Applicant: Samsung Electronics Co., Ltd

Inventor： Jea-Muk Oh ,  Sangil Kim ,  Byoungjun Min ,  Jongpil Park

IPC: G01R31/26 ,  G01R31/28

CPC classification number: G01R31/2601 ,  G01R31/2865 ,  G01R31/2874

Abstract: A test handler and a test method of a semiconductor device using the same includes a plurality of chambers to provide a sealed inner space accommodating a first tray on which semiconductor devices are mounted, a test module electrically connected to the semiconductor devices in the chambers to perform a test process of the semiconductor devices, and a sort part to load and unload the first tray in the chambers and to sort semiconductor devices determined to be failed in the test process. The plurality of chambers have a fluid path circulating a coolant or a heat medium in the walls so that a temperature of the plurality of chambers is rapidly changed at the test process of the semiconductor devices between a first temperature that is less than room temperature and a second temperature that is greater than room temperature.

Abstract translation: 使用该半导体器件的半导体器件的测试处理器和测试方法包括多个室以提供容纳其上安装有半导体器件的第一托盘的密封内部空间，测试模块电连接到腔室中的半导体器件以执行 半导体器件的测试过程，以及用于加载和卸载腔室中的第一托盘的分类部件，并且在测试过程中对被确定为失败的半导体器件进行分类。 多个室具有在壁中循环冷却剂或热介质的流体路径，使得在半导体器件的测试过程中，在小于室温的第一温度和 第二温度大于室温。

公开(公告)号：US20140306727A1

公开(公告)日：2014-10-16

申请号：US14146119

申请日：2014-01-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungsook Lee ,  Jongpil Park ,  Kwon-Bon Koo ,  Moon-Seok Kim ,  Byoungjun Min

IPC: G01R31/26 ,  G01R31/3187

CPC classification number: G01R31/2868

Abstract: A test facility may be used to test semiconductor devices. The test facility may include a stacker part configured to communicate with a server, wherein the server includes test programs for testing semiconductor devices, and a plurality of test board parts disposed in the stacker part, at least one of the test board parts including semiconductor devices disposed thereon and configured to provide at least one of the test programs from the server to the semiconductor devices. The stacker part may include unit stackers which include shelves configured to hold the plurality of test board parts and a stacker controller configured to communicate with the test board parts in the unit stackers and the server.

Abstract translation: 测试设备可用于测试半导体器件。 测试设备可以包括配置成与服务器通信的堆叠器部件，其中服务器包括用于测试半导体器件的测试程序，以及设置在堆叠器部分中的多个测试板部件，至少一个测试板部件包括半导体器件 设置在其上并且被配置为提供从服务器到半导体器件的测试程序中的至少一个。 堆垛机部分可以包括单元堆垛机，其包括被配置为保持多个测试板部件的搁架和被配置为与单元堆垛机和服务器中的测试板部件通信的堆垛机控制器。