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    ELECTRONIC APPARATUS AND METHOD FOR CONTROLLING THEREOF
    2.
    发明公开
    ELECTRONIC APPARATUS AND METHOD FOR CONTROLLING THEREOF 审中-公开

    公开(公告)号：US20230247103A1

    公开(公告)日：2023-08-03

    申请号：US18300066

    申请日：2023-04-13

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jungho PARK ,  Yul KIM ,  Sejeong KWON ,  Soohyung KIM ,  Wonsuk YANG ,  Kyunghwan LEE ,  Junhyuk LEE

    IPC: H04L67/50 ,  H04L43/04 ,  H04L41/16

    CPC classification number: H04L67/535 ,  H04L43/04 ,  H04L41/16

    Abstract: An electronic apparatus is provided. The electronic apparatus includes a communication interface, a memory storing log data with respect to external devices connected to the electronic apparatus, and a processor configured to identify a plurality of external devices having a history of being connected to the same internet protocol (IP) based on the log data, acquire, based on the log data, a first feature vector with respect to a relationship between the plurality of external devices and a second feature vector with respect to each of the plurality of external devices, acquire a graph of the relationship between the plurality of external devices based on the first feature vector and the second feature vector, and define at least one group configured by the plurality of external devices based on the graph.

    ANTENNA STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME
    3.
    发明公开
    ANTENNA STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME 审中-公开

    公开(公告)号：US20230387598A1

    公开(公告)日：2023-11-30

    申请号：US18446906

    申请日：2023-08-09

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Youngsub KIM ,  Sanghoon PARK ,  Jungho PARK ,  Kwanghyun BAEK ,  Youngju LEE ,  Jungyub LEE ,  Juneseok LEE ,  Dohyuk HA ,  Jinsu HEO

    IPC: H01Q9/04 ,  H01Q21/06

    CPC classification number: H01Q9/0457 ,  H01Q9/0414 ,  H01Q21/065

    Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4th generation (4G) communication system such as long term evolution (LTE). An antenna structure of a wireless communication system is provided. The antenna structure includes a first radiator, a first printed circuit board (PCB) in which the first radiator is arranged, a plurality of second radiators, a second PCB in which the plurality of second radiators are arranged, and a frame structure, wherein the frame structure is arranged such that an air layer is formed between the first PCB and the second PCB, and the plurality of second radiators can include a first metal patch arranged in a region corresponding to the first radiator, and a plurality of second metal patches arranged to be separated from the first metal patch so as to be fed by coupling.

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20210125908A1

    公开(公告)日：2021-04-29

    申请号：US16946209

    申请日：2020-06-10

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yeonho JANG ,  Jongyoun KIM ,  Jungho PARK ,  Jaegwon JANG

    IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

    Abstract: A semiconductor package includes a semiconductor chip; a redistribution insulating layer including a first opening; an external connection bump including a first part in the first opening; a lower bump pad including a first surface in physical contact with the first part of the external connection bump and a second surface opposite to the first surface, wherein the first surface and the redistribution insulating layer partially overlap; and a redistribution pattern that electrically connects the lower bump pad to the semiconductor chip.

    WAFER LEVEL PACKAGE
    6.
    发明申请
    WAFER LEVEL PACKAGE 有权

    公开(公告)号：US20210104489A1

    公开(公告)日：2021-04-08

    申请号：US16869988

    申请日：2020-05-08

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jinwoo PARK ,  Jungho PARK ,  Dahye KIM ,  Minjun BAE

    IPC: H01L23/00 ,  H01L23/31 ,  H01L25/065

    Abstract: Provided are a wafer level package and a method of manufacturing the same, wherein an underfill sufficiently fills a space between a redistribution substrate and a semiconductor chip, thereby reducing warpage. The wafer level package includes a redistribution substrate including at least one redistribution layer (RDL), a semiconductor chip on the redistribution substrate, and an underfill filling a space between the redistribution substrate and the semiconductor chip. The underfill covers side surfaces of the semiconductor chip. The redistribution substrate includes a trench having a line shape and extending in a first direction along a first side surface of the semiconductor chip.

    ELECTRONIC APPARATUS FOR CLUSTERING GRAPH DATA ON BASIS OF GNN AND CONTROL METHOD THEREFOR
    7.
    发明申请
    ELECTRONIC APPARATUS FOR CLUSTERING GRAPH DATA ON BASIS OF GNN AND CONTROL METHOD THEREFOR 有权

    公开(公告)号：US20250156480A1

    公开(公告)日：2025-05-15

    申请号：US19024992

    申请日：2025-01-16

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Soohyung KIM ,  Sejeong KWON ,  Yul KIM ,  Jungho PARK ,  Wonsuk YANG ,  Kyunghwan LEE ,  Junhyuk LEE

    IPC: G06F16/901 ,  G06F11/34 ,  G06F18/214 ,  G06F18/2321

    Abstract: A control method for an electronic apparatus includes, obtaining, based on log data of devices, a first graph including first information regarding devices and second information regarding relevance among the devices; obtaining an edge-based second graph based on the first graph such that edges of the second graph include edges of the first graph, and the second edges include third information regarding clustering rules from the edges of the first graph; converting the second graph into a node-based third graph such that nodes of the third graph include the third information; converting the third information into probability labels of the nodes, wherein a probability label indicates relevance between two devices from among the devices; converting the third graph into an edge-based fourth graph such that edges of the fourth graph include the probability labels; and clustering the devices into groups based on the first graph and the fourth graph.

    ELECTRONIC DEVICE INCLUDING INTERPOSING BOARD FOR ANTENNA
    8.
    发明公开
    ELECTRONIC DEVICE INCLUDING INTERPOSING BOARD FOR ANTENNA 审中-公开

    公开(公告)号：US20230216180A1

    公开(公告)日：2023-07-06

    申请号：US18185085

    申请日：2023-03-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Juneseok LEE ,  Kwanghyun BAEK ,  Dohyuk HA ,  Jungho PARK ,  Sangho LEE ,  Youngju LEE ,  Wuseong LEE

    IPC: H01Q1/24 ,  H01Q1/22

    CPC classification number: H01Q1/246 ,  H01Q1/2283

    Abstract: A 5th Generation (5G) or pre-5G communication system for supporting a data transfer rate higher than that of a post-4th Generation (4G) communication system such as Long Term Evolution (LTE) is provided. The radio unit (RU) device includes a first printed circuit board (PCB) on which a plurality of antenna elements are disposed, a second PCB on which a radio frequency integrated circuit (RFIC) is disposed, and a third PCB configured to electrically connect each of the plurality of antenna elements and the RFIC between the first PCB and the second PCB, a first surface of the third PCB is coupled to a first surface of the first PCB through a grid array, and positions of feeding ports on the first surface of the third PCB correspond to positions in which ports of the plurality of antenna elements are disposed on a second surface opposite the first surface of the first PCB.

    WAFER LEVEL PACKAGE
    9.
    发明申请
    WAFER LEVEL PACKAGE 有权

    公开(公告)号：US20220157772A1

    公开(公告)日：2022-05-19

    申请号：US17592947

    申请日：2022-02-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jinwoo PARK ,  Jungho PARK ,  Dahye KIM ,  Minjun BAE

    IPC: H01L23/00 ,  H01L25/065 ,  H01L23/31

    Abstract: Provided are a wafer level package and a method of manufacturing the same, wherein an underfill sufficiently fills a space between a redistribution substrate and a semiconductor chip, thereby reducing warpage. The wafer level package includes a redistribution substrate including at least one redistribution layer (RDL), a semiconductor chip on the redistribution substrate, and an underfill filling a space between the redistribution substrate and the semiconductor chip. The underfill covers side surfaces of the semiconductor chip. The redistribution substrate includes a trench having a line shape and extending in a first direction along a first side surface of the semiconductor chip.

    ANTENNA DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME
    10.
    发明申请
    ANTENNA DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME 有权

    公开(公告)号：US20220109249A1

    公开(公告)日：2022-04-07

    申请号：US17496326

    申请日：2021-10-07

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Juneseok LEE ,  Jinsu HEO ,  Youngsub KIM ,  Jungho PARK ,  Kwanghyun BAEK ,  Youngju LEE ,  Kyoungho JEONG ,  Dohyuk HA

    IPC: H01Q21/06 ,  H01Q9/04 ,  H01Q1/24

    Abstract: According to various embodiments of the disclosure, an antenna device comprises: a first antenna array including an array of a plurality of first radiation patches, a communication circuit configured to transmit and/or receive a radio signal using at least one of the first radiation patches, and at least one first isolator comprising a conductor disposed in an area between two adjacent first radiation patches among the first radiation patches. The first isolator may include a first portion, a second portion disposed in parallel with the first portion, and a third portion electrically connecting the first portion with the second portion. The first portion and the second portion may be configured to generate current flows having a phase difference of 180 degrees with respect to each other.

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