公开(公告)号：US09450317B2

公开(公告)日：2016-09-20

申请号：US14204029

申请日：2014-03-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dongil Son ,  Kyuwon Choi ,  Jongchul Choi

IPC: H01R12/70 ,  H01R12/71 ,  H01R13/24

CPC classification number: H01R12/7088 ,  H01R12/716 ,  H01R13/24

Abstract: A connector of an electronic device and an electronic device having the same are provided. The connector of an electronic device may includes a mold fixed on a main board of the electronic device; a first connection pin having a first connecting portion protruded to one surface of the mold; and a second connecting portion separated from the mold and an extension that connects the second connecting portion and the mold.

Abstract translation: 提供电子设备的连接器和具有该连接器的电子设备。 电子设备的连接器可以包括固定在电子设备的主板上的模具; 第一连接销，其具有突出到模具的一个表面的第一连接部分; 以及与模具分离的第二连接部分和连接第二连接部分和模具的延伸部分。

公开(公告)号：US12080348B2

公开(公告)日：2024-09-03

申请号：US17820995

申请日：2022-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyuwon Choi ,  Suk Youn ,  Chanho Lee ,  Taehyung Kim ,  Sangyeop Baeck ,  Inhak Lee

IPC: G11C15/04

CPC classification number: G11C15/04

Abstract: A semiconductor device includes a substrate including a first memory cell, a second memory cell adjacent to the first memory cell in a first direction, and a comparator circuit adjacent to the first and second memory cells in a second direction intersecting the first direction; a true bit line and a complementary bit line electrically connected to the first and second memory cells and extending in the first direction from a first wiring layer on the substrate; a first power supply wiring on the first wiring layer, extending in the first direction between the true bit line and the complementary bit line and electrically connected to the first and second memory cells; first and second word lines extending in the second direction from a second wiring layer on the substrate different from the first wiring layer; first word line pads on the first wiring layer and electrically connecting the first memory cell to the first word line; second word line pads on the first wiring layer and electrically connecting the second memory cell to the second word line; and a first ground pad on the first wiring layer, electrically connected to the first and second memory cells, and in a same position as one of the first word line pads and one of the second word line pads in the second direction.

公开(公告)号：US20230178151A1

公开(公告)日：2023-06-08

申请号：US17820995

申请日：2022-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyuwon Choi ,  Suk Youn ,  Chanho Lee ,  Taehyung Kim ,  Sangyeop Baeck ,  Inhak Lee

IPC: G11C15/04

CPC classification number: G11C15/04

Abstract: A semiconductor device includes a substrate including a first memory cell, a second memory cell adjacent to the first memory cell in a first direction, and a comparator circuit adjacent to the first and second memory cells in a second direction intersecting the first direction; a true bit line and a complementary bit line electrically connected to the first and second memory cells and extending in the first direction from a first wiring layer on the substrate; a first power supply wiring on the first wiring layer, extending in the first direction between the true bit line and the complementary bit line and electrically connected to the first and second memory cells; first and second word lines extending in the second direction from a second wiring layer on the substrate different from the first wiring layer; first word line pads on the first wiring layer and electrically connecting the first memory cell to the first word line; second word line pads on the first wiring layer and electrically connecting the second memory cell to the second word line; and a first ground pad on the first wiring layer, electrically connected to the first and second memory cells, and in a same position as one of the first word line pads and one of the second word line pads in the second direction.

公开(公告)号：US12273992B2

公开(公告)日：2025-04-08

申请号：US17861630

申请日：2022-07-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngsun Lee ,  Jongmin Jeon ,  Hyunsuk Kim ,  Kyuwon Choi

IPC: H05K1/02 ,  H05K5/00 ,  H05K5/02

Abstract: A flexible printed circuit board (FPCB) of an electronic device including a flexible display having a shape deformed by a hinge structure is provided. The FPCB of an electronic device includes a plurality of bending portions and a plurality of non-bending portions. The plurality of bending portions is bent according to a deformation of a shape of the electronic device. The plurality of non-bending portions are positioned on a periphery of the plurality of bending portions. The plurality of bending portions and the plurality of non-bending portions are formed to have different thicknesses.