公开(公告)号：US20240121539A1

公开(公告)日：2024-04-11

申请号：US18481421

申请日：2023-10-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonrae CHO ,  Kiwon KIM ,  Taeeon KIM ,  Myungcheol LEE ,  Woojin CHO ,  Byounghee LEE

IPC: H04R1/02

CPC classification number: H04R1/02

Abstract: An electronic device includes a housing including a speaker hole, and a speaker module in the housing. The speaker module includes a speaker including a first surface outputting an audio signal, a second surface opposite to the first surface, and a third surface connecting the first surface and the second surface. The speaker module includes a first housing including a first portion including a first opening overlapping the first surface when viewed from above and a second portion disposed on the first portion, a second housing attached to the first housing and including a duct extending from the first opening to the speaker hole, a first space extending from the first opening through the duct to the speaker hole, and a second space in the first housing, being disconnected from the first space by the speaker. The second portion is configured to seal the second space.

公开(公告)号：US20230188888A1

公开(公告)日：2023-06-15

申请号：US18164057

申请日：2023-02-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngbae PARK ,  Changshik YOON ,  Kiwon KIM ,  Joohan KIM ,  Taeeon KIM ,  Jinju BAE ,  Incheol BAEK ,  Myungcheol LEE

IPC: H04R1/28 ,  H04R1/44

CPC classification number: H04R1/28 ,  H04R1/44 ,  H04R2499/11

Abstract: An electronic device includes a speaker module which includes a speaker unit and a first speaker housing that is coupled to the speaker unit in a first direction. The first speaker housing accommodates the speaker unit, and is arranged in the inner space of the electronic device. A soundproof device allows the inner space of the electronic device to communicate with the outside, and an acoustic passage connects the soundproof device and a portion from which a sound is radiated by the speaker unit of the speaker module. The speaker module can further include an airtight member for sealing a gap between the speaker module and the acoustic passage so that the sound radiated from the speaker unit is transmitted to the acoustic passage.

公开(公告)号：US20220394374A1

公开(公告)日：2022-12-08

申请号：US17842107

申请日：2022-06-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hunki LEE ,  Joonrae CHO ,  Kiwon KIM ,  Myeungseon KIM ,  Choonghyo PARK ,  Seongkwan YANG ,  Myungcheol LEE ,  Byounghee LEE ,  Woojin CHO

IPC: H04R1/28 ,  H04R1/02

Abstract: An electronic device is provided. The electronic device includes a speaker module. The speaker module includes an enclosure including a first housing and a second housing and a speaker driver included in the first housing. The second housing includes an adsorption cavity forming a back volume of the speaker driver, a variable structure included in at least a part of the second housing, at least one vent hole for ventilation between the adsorption cavity and an external environment, and a housing cover fixed to the variable structure. The adsorption cavity is filled with an adsorptive filler.

公开(公告)号：US20210037312A1

公开(公告)日：2021-02-04

申请号：US16909393

申请日：2020-06-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonrae CHO ,  Changshik YOON ,  Kiwon KIM ,  Myeungseon KIM ,  Taeeon KIM ,  Myungcheol LEE ,  Byounghee LEE ,  Seongkwan YANG ,  Woojin CHO ,  Hochul HWANG

IPC: H04R1/28 ,  H04M1/03

Abstract: In various embodiments, an electronic device includes: a diaphragm, a speaker module including a speaker configured to output a sound through a vibration of the diaphragm, and a housing accommodating the diaphragm and the speaker module therein and including a first space provided in a first direction from the speaker module and a second space provided in a second direction opposite the first direction. The electronic device further includes an air adsorption member comprising an air adsorbing material disposed in the first space and having a volume ratio of 90% or less of the first space, the air adsorption member configured to reduce air resistance to the diaphragm disposed above the speaker module without limiting the vibration of the diaphragm.

公开(公告)号：US20240388839A1

公开(公告)日：2024-11-21

申请号：US18786725

申请日：2024-07-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonrae CHO ,  Changshik YOON ,  Kiwon KIM ,  Myeungseon KIM ,  Taeeon KIM ,  Myungcheol LEE ,  Byounghee LEE ,  Seongkwan YANG ,  Woojin CHO ,  Hochul HWANG

IPC: H04R1/28 ,  H04M1/03 ,  H04R1/02

Abstract: In various embodiments, an electronic device includes: a diaphragm, a speaker module including a speaker configured to output a sound through a vibration of the diaphragm, and a housing accommodating the diaphragm and the speaker module therein and including a first space provided in a first direction from the speaker module and a second space provided in a second direction opposite the first direction. The electronic device further includes an air adsorption member, comprising an air adsorbing material including a powder and granulated mixture, and disposed in a part of the first housing and/or second housing or disposed between the first housing and the second housing.

公开(公告)号：US20230095381A1

公开(公告)日：2023-03-30

申请号：US18075046

申请日：2022-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngbae PARK ,  Myungcheol LEE ,  Kiwon KIM ,  Taeeon KIM ,  Changshik YOON ,  Joonrae CHO

IPC: H04R1/28 ,  H04R1/02

Abstract: A speaker module structure according to various embodiments may include a first structure, a second structure configured to couple to the first structure, and a speaker coupled to at least one of the first structure or the second structure, wherein the second structure comprises at least one groove configured to form a resonance space by coupling between the first structure and the second structure, the resonance space is connected to the speaker and has an adsorption material injected therein, and when the first structure and the second structure are coupled, one end of the groove comprises an opening formed in a closed loop comprising a part of the first structure and a part of the second structure.

公开(公告)号：US20170277359A1

公开(公告)日：2017-09-28

申请号：US15449287

申请日：2017-03-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myungcheol LEE ,  Sunghoon KIM ,  Changjin SONG ,  Donghyun YEOM ,  Jiwoo LEE

IPC: G06F3/043 ,  G06F3/041 ,  H04R17/00

CPC classification number: H04R17/00 ,  G06F1/1626 ,  G06F1/1637 ,  G06F1/165 ,  G06F1/1688 ,  G06F3/041 ,  G06F3/0412 ,  G06F2203/04105 ,  H04R2400/03 ,  H04R2499/11 ,  H04R2499/15

Abstract: An electronic device and sound output method thereof are provided. The electronic device may include: an input unit comprising input circuitry configured to sense an input from outside of the electronic device; a plurality of piezo drivers including a first piezo driver and a second piezo driver; and a processor functionally connected with the input unit. The processor may be configured to detect an input through the input unit, to use a first piezo driver set including the first piezo driver to output sounds when the detected input corresponds to a first input, and to use a second piezo driver set including the second piezo driver to output sounds when the detected input corresponds to a second input.

公开(公告)号：US20230300520A1

公开(公告)日：2023-09-21

申请号：US18322160

申请日：2023-05-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taeeon KIM ,  Kiwon KIM ,  Seongkwan YANG ,  Myungcheol LEE ,  Joonrae CHO ,  Seungnam KIM ,  Taewoo KIM ,  Jaehee YOU ,  Kwanhee HAN ,  Seungyoon HEO

IPC: H04R1/28 ,  H04M1/02 ,  H04R1/02

CPC classification number: H04R1/2857 ,  H04M1/026 ,  H04R1/028 ,  H04R1/288 ,  H04R2499/11 ,  H04R2499/15

Abstract: An electronic device is provided. The electronic device includes a housing including a front plate, a rear plate disposed to be spaced a predetermined distance apart from the front plate in parallel, and a side plate surrounding a space formed between the front plate and the rear plate, an opening disposed between an upper edge of the front plate and the side plate, a speaker including a sound radiation part in a direction of being directed toward the front plate and disposed inside the housing, a support member disposed to extend from the sound radiation part toward the upper edge of the front plate, and a pipeline including a space formed between the front plate and the support member. The pipeline may include a first structure disposed adjacent to the sound radiation part and a second structure disposed adjacent to the opening, and the second structure may be disposed to be spaced a predetermined length apart from the first structure in a direction of forming an acute angle with respect to a reference line orthogonal to the upper edge.

公开(公告)号：US20230033112A1

公开(公告)日：2023-02-02

申请号：US17965378

申请日：2022-10-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joonrae CHO ,  Myeungseon KIM ,  Myungcheol LEE ,  Kiwon KIM ,  Hunki LEE ,  Woojin CHO

IPC: H04R9/04 ,  H04R9/06 ,  H04R1/02 ,  H05K1/18

Abstract: An electronic device including a speaker with a porous sheet, a speaker is provided. The electronic device includes a main body, a sound generator, which includes a voice coil, a sound body surrounding the voice coil, and a terminal that is at least partially exposed to an outside of the sound body, a printed circuit board (PCB) connected to the terminal and extending outwardly from the main body, and a porous sheet inserted into the main body and spaced apart from the terminal.

公开(公告)号：US20210337055A1

公开(公告)日：2021-10-28

申请号：US17368280

申请日：2021-07-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myungcheol LEE ,  Minyoung GWAK ,  Hyeonhak KIM ,  Youngbae PARK ,  Jongjin JEONG ,  Seongho CHO ,  Hochul HWANG

IPC: H04M1/03 ,  H04M1/02 ,  H04R1/02

Abstract: An electronic device is provided. The electronic device includes a housing comprising a front plate facing a first direction, a back plate facing a second direction that is opposite the first direction, and an outer wall which encompasses the space between the front plate and the back plate and in which a pipe passage extending to the outside is arranged, a speaker module positioned in the space, which is adjacent to the pipe passage, a printed circuit board arranged along at least a part of the side surface of the speaker module and formed along the periphery of the region between the outer wall, having the pipe passage, and the speaker module, and a first sealing member arranged between the back plate and a bracket and formed into a closed loop along the edge of the speaker module.