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公开(公告)号:US20210217765A1
公开(公告)日:2021-07-15
申请号:US17024105
申请日:2020-09-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jiyoung KIM , Woosung YANG , Sejie TAKAKI
IPC: H01L27/11573 , H01L27/11582 , H01L27/11565 , H01L23/522 , H01L27/11519 , H01L27/11556 , H01L27/11534 , G11C7/18
Abstract: A 3D semiconductor memory device includes a peripheral circuit structure on a first substrate, a second substrate on the peripheral circuit structure, an electrode structure on the second substrate, the electrode structure comprising stacked electrodes, and a vertical channel structure penetrating the electrode structure. The peripheral circuit structure includes a dummy interconnection structure under the second substrate. The dummy interconnection structure includes stacked interconnection lines, and a via connecting a top surface of an uppermost one of the interconnection lines to a bottom surface of the second substrate.
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公开(公告)号:US20220139946A1
公开(公告)日:2022-05-05
申请号:US17214879
申请日:2021-03-28
Applicant: SAMSUNG ELECTRONICS CO, LTD.
Inventor: Sejie TAKAKI
IPC: H01L27/11575 , H01L27/11556 , H01L27/11529 , H01L27/11548 , H01L27/11582 , H01L27/11573 , H01L25/065 , H01L23/535
Abstract: A semiconductor device includes a memory stack on a substrate, the memory stack including gate electrodes, insulating layers and mold layers, the mold layers being disposed at the same levels as the gate electrodes in a through electrode area, a channel structure extending vertically through the gate electrodes in a cell array area, and a dam structure disposed between the isolation insulating layers and surrounding the through electrode area in a top view. The dam structure includes a dam insulating layer having a dam shape, an inner insulating layer inside the dam insulating layer, and an outer insulating layer outside the dam insulating layer. The inner insulating layer includes first protrusions protruding in a horizontal direction, and the outer insulating layer includes second protrusions protruding in the horizontal direction.
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