公开(公告)号：US20230115226A1

公开(公告)日：2023-04-13

申请号：US17941366

申请日：2022-09-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yonghwan HYUN ,  Jaehyun KWON ,  Jongmin KIM ,  Yangtack OH ,  Seongeun BAE

IPC: H01Q1/24 ,  H01Q5/328 ,  H01Q1/38

Abstract: An electronic device is provided. The electronic device includes a housing, a circuit board disposed in the housing and receiving a communication module, an antenna assembly disposed in the housing and including an antenna pattern electrically connected with the communication module and a ground pattern, and a conductive plate disposed on the antenna assembly. At least a portion of the ground pattern may be positioned between the antenna pattern and the conductive plate. The conductive plate may be configured to be electrically coupled with the antenna pattern through the ground pattern.