公开(公告)号：US20180017999A1

公开(公告)日：2018-01-18

申请号：US15650723

申请日：2017-07-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae Sik KIM ,  Myung Jae JO ,  Hye Won KANG ,  Ja Myeong KOO ,  Mu Jin KIM ,  Jeong Woon KOO ,  Dae Heon KWON ,  Sei Neu PARK ,  Won Hyun PARK ,  Jae Young YUN

IPC: G06F1/18 ,  G06F3/044 ,  G06F1/16 ,  H05K3/46 ,  H05K3/34 ,  H05K1/18 ,  H05K1/02

CPC classification number: G06F1/183 ,  G06F1/1601 ,  G06F1/1626 ,  G06F1/1658 ,  G06F3/044 ,  G06F2203/04111 ,  H05K1/0298 ,  H05K1/185 ,  H05K1/189 ,  H05K3/3447 ,  H05K3/4602 ,  H05K2201/095 ,  H05K2201/10121

Abstract: An electronic device includes a bracket having a through hole, a first circuit board and a second circuit board which are disposed below the bracket. The second circuit board is electrically connected with the first circuit board, and a first module and a second module are disposed above the bracket. The first module and the second module are electrically connected with the first circuit board via a wiring structure passing through the through hole.