公开(公告)号：US12302495B2

公开(公告)日：2025-05-13

申请号：US17900687

申请日：2022-08-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeonkyung Chung ,  Jichul Kim ,  Jinyong Park ,  Gyeongmin Jin

IPC: H05K1/11 ,  H04M1/02 ,  H05K1/02 ,  H05K3/34

Abstract: According to an embodiment, an electronic device may include a first printed circuit board (PCB), a second PCB having a shape corresponding to the first PCB, and an interposer surrounding a space between the first PCB and the second PCB and including multiple pads, wherein the interposer may include a first surface in contact with the first PCB, a second surface in contact with the second PCB, a first lateral surface facing the space, and a second lateral surface opposite to the first lateral surface, and a first point exposed through the second lateral surface, a second point exposed through one of the first lateral surface or the second lateral surface, and a heat conduction pattern disposed on the first surface in an area between the multiple pads to connect the first point and the second point.