公开(公告)号：US20210022247A1

公开(公告)日：2021-01-21

申请号：US16868941

申请日：2020-05-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangwon HA ,  Subyung KANG ,  Sanghoon PARK ,  Soohyun SEO ,  Yongjin WOO ,  Yeomoon YOON

IPC: H05K1/14 ,  H01L23/40

Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.

公开(公告)号：US20220400572A1

公开(公告)日：2022-12-15

申请号：US17893739

申请日：2022-08-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghoon PARK ,  Seungbo SHIM ,  Yongjin WOO ,  Junhee HAN ,  Dongil SON

IPC: H05K7/14 ,  H05K5/00 ,  H05K1/02

Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in the inner space of the housing, a second printed circuit board disposed so as to overlap at least a portion of the first printed circuit board, when the first printed circuit board is viewed from above, a first interposer disposed between the first printed circuit board and the second printed circuit board, and electrically connecting the first printed circuit board and the second printed circuit board, and at least one second interposer which is disposed between the first printed circuit board and the second printed circuit board so as to be spaced apart from the first interposer when the first printed circuit board is viewed from above, and which electrically connects the first printed circuit board and the second printed circuit board.

公开(公告)号：US20230403795A1

公开(公告)日：2023-12-14

申请号：US18456153

申请日：2023-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangwon HA ,  Subyung KANG ,  Sanghoon PARK ,  Soohyun SEO ,  Yongjin WOO ,  Yeomoon YOON

IPC: H05K1/14

CPC classification number: H05K1/145 ,  H05K1/144 ,  H01L2023/4087

Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.

公开(公告)号：US20210029826A1

公开(公告)日：2021-01-28

申请号：US16930589

申请日：2020-07-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wooyoung JEONG ,  Yongjin WOO ,  Dongjun KIM ,  Sungchang JANG

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/14

Abstract: According to an embodiment, an interposer structure comprises a top surface, a bottom surface facing away from the top surface; an inner sidewall extending from the top surface to the bottom surface, and forming an inner space accommodating one or more electronic components mounted on a circuit board of an electronic device; and an outer sidewall extending from the top surface to the bottom surface, and facing away from the inner sidewall, wherein the outer sidewall includes: a first area having a conductive member formed from the top surface to the bottom surface; and a second area having a conductive member formed from the top surface to a first position and a non-conductive member formed from the first position to the bottom surface.