公开(公告)号：US20140113415A1

公开(公告)日：2014-04-24

申请号：US13924705

申请日：2013-06-24

Applicant: Samsung Techwin Co., Ltd.

Inventor： Sang-Min LEE

IPC: H01L21/52 ,  H05K1/18 ,  H05K3/46

CPC classification number: H01L21/52 ,  H01L23/053 ,  H01L23/145 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/12042 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/002 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/09118 ,  H05K2201/09536 ,  H05K2201/09845 ,  H05K2203/0554 ,  H01L2224/45099 ,  H01L2924/00

Abstract: Provided is a method of manufacturing a circuit board. The method includes: preparing a base substrate including a core layer and a first conductive layer that is formed on at least one surface of the core layer and includes an internal circuit pattern; forming a build-up material to cover the first conductive layer; forming in the build-up material at least one cavity through which the core layer and the first conductive layer are exposed; forming a laminated body by curing the build-up material in which the at least one cavity is formed; and forming a second conductive layer including an external circuit pattern on an outer surface of the laminated body.

Abstract translation: 提供一种制造电路板的方法。 该方法包括：制备包括芯层的基底基板和形成在芯层的至少一个表面上并包括内部电路图案的第一导电层; 形成积层材料以覆盖所述第一导电层; 在堆积材料中形成芯层和第一导电层暴露的至少一个空腔; 通过固化形成所述至少一个腔的所述积聚材料来形成层压体; 以及在所述层叠体的外表面上形成包括外部电路图案的第二导电层。

公开(公告)号：US20130192885A1

公开(公告)日：2013-08-01

申请号：US13756942

申请日：2013-02-01

Applicant: SAMSUNG TECHWIN CO., LTD.

Inventor： Sang-Min LEE ,  Soon-Chul KWON

IPC: H05K3/00 ,  H05K1/03 ,  H05K1/02

CPC classification number: H05K3/0058 ,  H05K1/02 ,  H05K1/0353 ,  H05K3/28 ,  H05K2203/0585

Abstract: Provided are a method of forming a solder resist layer on a printed circuit board (PCB) and a PCB comprising the solder resist layer. The method includes: preparing a PCB of which at least one surface has a circuit layer formed thereon, bonding an insulation layer, including a material having a non-photosensitive characteristic, in a half-cured state on the circuit layer, forming a solder resist layer patterned by selectively removing the insulation layer, and curing the insulation layer.

Abstract translation: 提供了在印刷电路板（PCB）上形成阻焊层的方法和包含阻焊层的PCB​​。 该方法包括：制备其上形成有电路层的至少一个表面的PCB，在电路层上以半固化状态将包含具有非感光特性的材料的绝缘层粘合在一起，形成阻焊层 通过选择性地去除绝缘层并且使绝缘层固化来图案化。