公开(公告)号：US20120153473A1

公开(公告)日：2012-06-21

申请号：US13046396

申请日：2011-03-11

Applicant: Sang Yul LEE

Inventor： Sang Yul LEE

IPC: H01L23/49 ,  H01B5/00

CPC classification number: H05K3/4015 ,  H01L23/49811 ,  H01L2924/00013 ,  H01L2924/0002 ,  H05K2201/10318 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

Abstract: Disclosed herein is a lead pin for a package substrate including a connection pin, and a head part including a flange part formed at one end of the connection pin and having one surface bonded to the connection pin and a flat part formed at the other surface of the flange part and having at least one groove formed along an outer circumference thereof. According to the present invention, the grooves are formed along the outer circumference of the flat part of the head part of the lead pin to increase a bonding area, thereby making it possible to increase bonding strength of the lead pin.

Abstract translation: 本文公开了一种用于包括连接销的封装基板的引脚，以及包括形成在连接销的一端并且具有一个表面接合到连接销的凸缘部分的头部，以及形成在连接销的另一个表面上的平坦部分 所述凸缘部分具有沿其外圆周形成的至少一个凹槽。 根据本发明，沿着引脚的头部的平坦部分的外圆周形成沟槽以增加接合面积，从而可以提高引脚的接合强度。