公开(公告)号：US09950430B1

公开(公告)日：2018-04-24

申请号：US15370312

申请日：2016-12-06

Applicant: Schaft Inc.

Inventor： Nobuyuki Ito ,  Junichi Urata ,  Koichi Nishiwaki

IPC: G05B15/00 ,  G06F19/00 ,  B25J9/16

CPC classification number: B25J9/1694 ,  B25J9/161 ,  B25J9/1664 ,  G05B19/21 ,  G05B2219/37175 ,  G05B2219/41422 ,  G05F1/66 ,  Y10S901/02 ,  Y10S901/28 ,  Y10S901/46

Abstract: A robotic system may include an incremental encoder coupled to a joint of the system. The robotic system may include a memory configured to store representations of angular positions of the joint. The robotic system may include a motor coupled to the joint, where rotation of the joint while the motor is powered off (i) causes rotation of the motor such that electric power is generated, and (ii) updates the angular position of the joint. The robotic system may use the electric power to power on the incremental encoder and the memory while the robotic system is powered off. One or more processors may obtain, when the robotic system powers on after being powered off, the updated angular position of the joint from the memory, where the incremental encoder provides the updated angular position to the memory while the robotic system is powered off.

公开(公告)号：US20180241285A1

公开(公告)日：2018-08-23

申请号：US15441123

申请日：2017-02-23

Applicant: Schaft Inc.

Inventor： Akihiko Sasaki ,  Nobuyuki Ito ,  Junichi Urata

IPC: H02K9/00 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K1/09 ,  H02K11/33

CPC classification number: H02K9/005 ,  H02K11/33 ,  H05K1/0204 ,  H05K1/05 ,  H05K1/09 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/066 ,  H05K2201/10166 ,  H05K2201/10416

Abstract: A system includes a primary Printed Circuit Board (PCB) and a heat transfer device that is attached to the primary PCB. The primary PCB includes a heat generating device and a thermal conductive inlay attached to the heat generating device. The heat transfer device includes a secondary PCB that is thermally coupled to the primary PCB, and a heat dissipation block. The heat dissipation block has a first side attached to the thermal conductive inlay of the primary PCB and a second side attached to the secondary PCB.

公开(公告)号：US10199904B2

公开(公告)日：2019-02-05

申请号：US15441123

申请日：2017-02-23

Applicant: Schaft Inc.

Inventor： Akihiko Sasaki ,  Nobuyuki Ito ,  Junichi Urata

IPC: H02K9/00 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K1/09 ,  H02K11/33 ,  H05K1/05

Abstract: A system includes a primary Printed Circuit Board (PCB) and a heat transfer device that is attached to the primary PCB. The primary PCB includes a heat generating device and a thermal conductive inlay attached to the heat generating device. The heat transfer device includes a secondary PCB that is thermally coupled to the primary PCB, and a heat dissipation block. The heat dissipation block has a first side attached to the thermal conductive inlay of the primary PCB and a second side attached to the secondary PCB.