公开(公告)号：US20230318257A1

公开(公告)日：2023-10-05

申请号：US17657164

申请日：2022-03-30

Applicant: Seagate Technology LLC

Inventor： Fadi El Hallak ,  Bryn John Howells ,  Michael Gerald Boyle ,  Frank Anthony McGinnity ,  Martin Liam McGarry

IPC: H01S5/024 ,  H01S5/026

CPC classification number: H01S5/02476 ,  H01S5/026 ,  G11B2005/0021

Abstract: A method comprising the steps of forming a recording head comprising a waveguide, a heat sink and a bleed resistor on a first substrate, is described. The bleed resistor is coupled to the heat sink and the substrate. The top surface of the heat sink is planarized to form a planarized heat sink. A laser diode formed on a second substrate is transfer printed onto the planarized heat sink to form an integrated laser diode.

公开(公告)号：US11328744B1

公开(公告)日：2022-05-10

申请号：US17162182

申请日：2021-01-29

Applicant: Seagate Technology LLC

Inventor： Fadi El Hallak ,  Michael Gerald Boyle ,  Paula Frances McElhinney ,  Marcus Benedict Mooney ,  Aidan Dominic Goggin ,  Cillian Macdara OBriain Fallon

IPC: G11B11/105 ,  G11B5/48 ,  G11B5/31 ,  H01S3/063 ,  G11B5/60 ,  G11B5/00

Abstract: An apparatus comprises a substrate. A laser is deposited above the substrate. The laser includes one or more non-self-supporting layers of crystalline material. A metallic adhesive is disposed between the laser and the substrate. The metallic adhesive is configured to adhere the laser to the substrate. A waveguide is deposited proximate the laser. The waveguide is configured to receive light from the laser and direct the light to a recording medium.