公开(公告)号：US12157847B1

公开(公告)日：2024-12-03

申请号：US16715913

申请日：2019-12-16

Applicant: Seagate Technology LLC

Inventor： Zubair Ahmed Khan ,  Sarah R. Marotz ,  Willis J. Johnson ,  Andrew D. Habermas

IPC: C09J133/12 ,  B24B37/11 ,  C09J7/38 ,  C09J7/40 ,  C09J133/08 ,  H01L21/02 ,  H01L21/673 ,  B05D5/10

Abstract: The present disclosure relates to methods of forming adhesive films having at least one pressure-sensitive adhesive polymer, related films, and related methods of using such films in lapping processes.